AMD Ryzen AI MAX+ 395 “Strix Halo” APU Tested In 3DMark Time Spy: Radeon 8060S iGPU Offers Over Triple The Uplift Versus Radeon 890M

Feb 12, 2025 at 01:30pm EST
AMD Ryzen AI Max+ Pro 395 & Ryzen AI Max Pro 390 "Strix Halo" APUs Benchmarked, GPU On Par With RTX 3060 12 GB 1

AMD's enthusiast-grade Ryzen AI MAX+ 395 "Strix Halo" APU has been tested in 3DMark with the Radeon 8050S iGPU offering a huge uplift.

Double The iGPU For Over Triple The Performance: AMD Strix Halo "Ryzen AI MAX+ 395" 3DMark Performance Is Shockingly Good Thanks To Radeon 8050S

Last month, AMD unveiled the ultimate mobile workstation solution in the form of Ryzen AI Max, codenamed Strix Halo. These APUs offer some insane specs, such as up to 16 Zen 5 cores, up to 40 RDNA 3.5 iGPU cores, lots of bandwidth, and a strong set of IO capabilities. While the first PCs and laptops featuring these APUs are on the horizon, it looks like Baudi Forums have published the first results of these massively powerful APUs.

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The leak in question shows an alleged screenshot in 3DMark Time Spy with the GPU tab listing the "Radeon 8050S" while the CPU tab lists the "AMD Eng Sample: 100-000001243-50_Y". We checked the OPN ID and this seems to be the Ryzen AI MAX+ 395 with the Radeon 8060S instead of the AMD Radeon 8050S iGPU.

Image Source: Baidu Forums

The difference between the two is that the Radeon 8060S packs the full 40 Compute Units while the Radeon 8050S is configured with 32 Compute Units. The CPU for each iGPU is also different and the one tested here packs 16 Zen 5 cores instead of the 12 Zen 5 cores featured on the Ryzen AI MAX 390. In terms of iGPU, you are looking at over double the iGPU cores versus AMD's current top gun, the Radeon 890M (16 Compute Units). The biggest benefit of this chip is that it offers up to 256 GB per second of bandwidth, which would help the graphics capabilities of this APU.

In terms of performance, the AMD Ryzen AI MAX+ 395 scored an overall score of 9006, a graphics score of 10,106, and a CPU score of 5571 points in 3DMark Time Spy.

3DMark Time Spy (Higher is Better)
Graphics Score
0
4000
8000
12000
16000
20000
24000
0
4000
8000
12000
16000
20000
24000
Intel Arc B580
14700
AMD Radeon RX 7600
10990
NVIDIA RTX 4060
10614
Radeon 8060S (40 CU / Ryzen AI MAX+ 395)
10106
NVIDIA RTX 3060
8746
Arc 140V (8 Xe2 / Core Ultra 9 288V)
3996
Radeon 890M (16 CU / Ryzen AI 9 HX 370)
3367

While the CPU score is low, the Radeon 8060S iGPU delivers a fantastic result versus the Radeon 890M, which can only manage an average of 3367 points according to 3DMark's database. This is a 3x improvement over Strix & is amazing. One should also point out that the standard Strix chips have a TDP of 30-45W while Strix Halo APUs will feature up to 120W TDP, a 3x difference.

The Radeon 8060S with 40 Compute Units performs just on par with other mainstream graphics cards such as the Radeon RX 7600 and GeForce RTX 4060. This is very strong performance for an iGPU and we can only expect updated architectures such as RDNA 4 to further uplift the internal graphics capabilities on these APUs.

AMD's first Strix Halo-powered PCs are expected to land in the first half of 2025, so expect more details and prices of these powerful workstation designs soon.

AMD Ryzen AI MAX 300 "Strix Halo" APU Lineup:

SKU NameArchitecturesCPU CoresMax ClockCacheGPU CoresTDP
Ryzen AI Max+ 395Zen 5 / RDNA 3.516 / 325.1 GHz80 MB40 CUs (Radeon 8060S)45-120W
Ryzen AI Max+ 392Zen 5 / RDNA 3.512 / 245.0 GHz76 MB40 CUs (Radeon 8060S)45-120W
Ryzen AI Max 390Zen 5 / RDNA 3.512 / 245.0 GHz76 MB32 CUs (Radeon 8050S)45-120W
Ryzen AI Max 385Zen 5 / RDNA 3.58 / 165.0 GHz40 MB32 CUs (Radeon 8050S)45-120W
Ryzen AI Max+ 388Zen 5 / RDNA 3.58 / 165.0 GHz40 MB40 CUs (Radeon 8060S)45-120W
Ryzen AI Max 380Zen 5 / RDNA 3.56 / 124.9 GHz22 MB16 CUs (Radeon 8040S)45-120W

News Source: HXL (@9550pro)

About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.

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