Two unreleased AMD CPUs have been spotted in PassMark, the Ryzen AI MAX+ 388 & the Ryzen 7 9700X3D, both of which are 8-core.
AMD Ryzen AI MAX+ 388 Is A Lighter Version of The Flagship 395 With Half The Cores But The Same Radeon 8060S iGPU, Ryzen 7 9700X3D, Also Spotted At PassMark
[Update - 11/8/2025] - The Ryzen 7 9700X3D entry is fake, source.
The PassMark Software benchmark database has listed two unreleased AMD Ryzen CPUs that haven't been announced yet. These include the Ryzen AI MAX+ 388 and the Ryzen 7 9700X3D. Both models are based on eight Zen 5 cores, so let's get into the specifications and performance.
AMD Ryzen AI MAX+ 388 "Strix Halo" SoC:
Starting with the AMD Ryzen AI MAX+ 388, this chip should be part of the Strix Halo SoC family. The current lineup includes four SKUs: the 395, 390, 385, and 380. The 388 seems to be the middle-ground, featuring the same cores as the entry-level 385 but the same iGPU as the 395.
The CPU is listed with 8 cores and 16 threads, and also packs the Radeon 8060S iGPU, which offers the full 40 RDNA 3.5 compute units. The 390 and 385 feature the Radeon 8050S iGPU, which packs 32 RDNA 3.5 compute units. Other details that are mentioned include 32 MB of L3 cache and 8 MB of L2 cache. That's about it; there are no clocks mentioned nor the TDP, but it should be similar to the 55W Default TDP of the other Ryzen AI MAX parts.
The AMD Ryzen AI MAX+ 388 should make for an interesting gaming SKU, offering the full RDNA 3.5 GPU experience while offering better value thanks to its 8-core CPU. There is also the possibility that this could be a China-specific model, so we will just have to wait and see whether the first products land in other regions or not.
In addition to the 388, AMD is also preparing a 12-core and 24-thread "Strix Halo" APU with the same Radeon 8060S iGPU. This chip will be called the Ryzen AI MAX+ 392 and features a boost clock of up to 5.0 GHz.
AMD Ryzen AI MAX 300 "Strix Halo" APU Lineup:
| SKU Name | Architectures | CPU Cores | Max Clock | Cache | GPU Cores | TDP |
|---|---|---|---|---|---|---|
| Ryzen AI Max+ 395 | Zen 5 / RDNA 3.5 | 16 / 32 | 5.1 GHz | 80 MB | 40 CUs (Radeon 8060S) | 45-120W |
| Ryzen AI Max+ 392 | Zen 5 / RDNA 3.5 | 12 / 24 | 5.0 GHz | 76 MB | 40 CUs (Radeon 8060S) | 45-120W |
| Ryzen AI Max 390 | Zen 5 / RDNA 3.5 | 12 / 24 | 5.0 GHz | 76 MB | 32 CUs (Radeon 8050S) | 45-120W |
| Ryzen AI Max 385 | Zen 5 / RDNA 3.5 | 8 / 16 | 5.0 GHz | 40 MB | 32 CUs (Radeon 8050S) | 45-120W |
| Ryzen AI Max+ 388 | Zen 5 / RDNA 3.5 | 8 / 16 | 5.0 GHz | 40 MB | 40 CUs (Radeon 8060S) | 45-120W |
| Ryzen AI Max 380 | Zen 5 / RDNA 3.5 | 6 / 12 | 4.9 GHz | 22 MB | 16 CUs (Radeon 8040S) | 45-120W |
AMD Ryzen 7 9700X3D 3D V-Cache CPU:
The other SKU that has been listed at PassMark is the AMD Ryzen 7 9700X3D. This chip is an 8-core and 16-thread part based on the Zen 6 core architecture. The CPU is listed with a clock speed of 5.8 GHz, but that feels way too off considering the Ryzen 7 9800X3D has a max boost clock rated at up to 5.2 GHz, and even the upcoming 8-core X3D refresh, the 9850X3D, is going to be clocked up to a rumored 5.6 GHz. So, it looks like this entry could be with overclocking involved or is a bogus clock speed.
AMD is preparing a Ryzen 9000X3D "3D V-Cache" CPU refresh with two variants, a dual X3D design and an 8-core X3D design. We don't know whether the 9700X3D will be a retail SKU, but it looks like we won't know for sure until the chip actually hits retail or is officially announced by AMD.
There are also some performance numbers for both chips, which can be compared with other 8-core AMD offerings:
PassMark (Higher is Better)
As always, these two AMD Ryzen CPUs are not official as of right now as such take this info with a grain of salt until more solid confirmations are made. We expect AMD to make new Ryzen CPU announcements at CES 2026, so stay tuned.
News Source: @realVictor_M
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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