AMD's next-generation EPYC CPUs based around the SP7 socket, such as Venice "Zen 6", could feature up to 1400W power consumption.
AMD's Next-Gen EPYC Venice "Zen 6" & SP7-Socketed CPUs Could Scale From 700W, All The Way Up To 1400W of Power
In a presentation by Taiwan Microloops Corp during the OCP APAC Summit, the company presented its advanced liquid cooling solutions for next-gen servers. These include the upcoming SP7 platform, which replaces SP5, the platform currently used for Genoa and Turin chips. The SP7 platform will house AMD's next-gen EPYC Venice "Zen 6" and Verano CPUs, with the former featuring up to 256 cores.
While AMD will be updating the overall specifications of these chips with higher core counts & expanded IO capabilities, these chips will also consume a lot of power. Now, a lot of power doesn't mean that these won't be power-efficient. As we have seen with each generation of EPYC CPUs, AMD has upped the power figures, but at the same time, these chips end up offering much higher performance, and each generation has surpassed the previous in terms of power efficiency.
So, coming to the solutions, Microloops has developed a new cold plate solution designed for kW-level cooling. That's right, AMD's SP7 socket will require some hefty cooling, and we are finally looking at kW-level cooling solutions. The cold plate features two ports, one inlet and one outlet, and the top features a metal stiffener that is screwed in place. The top also features an acrylic cover, and there are a total of six mounting screws, which is similar to the configuration used for SP5.
In its evaluation, the manufacturer lists the power scaling of AMD's EPYC SP7 chips, which starts at 700W and goes all the way up to 1400W. Currently, AMD's EPYC Turin chips go up to 500W, so 700W is already a 40% increase for SP7 chips.
The Turin chips can go beyond 500W in certain configurations, and we've also seen the enthusiast-grade Threadripper parts reach over 1kW of power when PBO is enabled. EPYC isn't designed around PBO, but it gives us an idea of where next-gen Threadrippers might go, with over 1000-1500W power when pushed to their limits.
During Hot Chips 2025, FABRIC8LABs proposed a new thermal solution beyond liquid-cooled cold plates. The company states that existing cold plates with straight channels have limited performance and as such, they have devised a new solution in the form of ECAM or Electrochemical Additive Manufacturing which offers anywhere from 20% to 85% higher thermal performance.
With ECAM, new and innovatives channel designs can be incorporated for both CPUs and GPUs. ECAM also offers lower thermal resistance and creates options for higher TDP chips at reduced operating costs.
AMD's EPYC Venice CPUs based on the Zen 6 core architecture will be the first to feature support on the SP7 platform. There will also be SP8 for entry-level platforms as detailed here. These chips will launch in the coming year and will compete with Intel's Clearwater Forest Xeon E-Core and Diamond Rapids Xeon P-Core families.
News Source: HXL (@9550pro)
About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.
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