AMD has confirmed that all of their upcoming 3rd Gen Ryzen 3000 series processors featuring the Zen 2 core architecture will feature a soldered design. Since the launch of their 1st generation, the Ryzen series has been utilizing a soldered design which helps deliver better thermal results when compared to traditional TIM application. AMD Ryzen 3000 Series CPUs To Utilize Soldered IHS With Gold Plating To Deliver Better Thermals & Overclocking Results AMD has so far used solder on all of their Ryzen CPUs, Ryzen Theadripper CPUs and the upcoming Ryzen ‘Picasso’ APUs are also confirmed to feature Soldered IHS. … Continue reading All AMD Ryzen 3000 CPUs Will Feature Soldered IHS, Expect Impressive Thermals & Great Overclocking Capability