iPhone 7 Plus Shown Off in the Black Color Variant With Its Rumored Dual Camera as Well

Omar Sohail
iPhone 7 Plus back color model with dual camera

There are several color models expected to be unveiled at Apple’s September event, when the announcement of iPhone 7 and iPhone 7 Plus are kicked off. However, before the grand unveiling, here are some more photos of the phablet showing off its highly anticipated dual camera setup.

Very Subtle Design Changes Between iPhone 6s Plus and iPhone 7 Plus – Check Out the Images Right Here

From a design standpoint, there isn’t really much separating the iPhone 6s Plus and iPhone 7 Plus, but not if you look closely. For starters, the most prominent difference you will find out from iPhone 7 Plus is its dual camera setup present at the rear side, and if you look at the bottom side of the phone, the antenna lines are arranged much differently compared to that on an iPhone 6s Plus. However, perhaps the biggest difference is the color model shown in the images below, but do let us know what differences you were able to find from both handsets.

iPhone 7 Plus (1)

Last year, when iPhone 6s and iPhone 6s Plus were announced, only Qualcomm was tasked with producing the LTE chips for the tech giant. This time however, Intel has also become a mass producer of LTE chips for the company, which is very shrewd thinking on Apple’s part.

iPhone 7 Plus (4)

From a business standpoint, with both companies manufacturing LTE chips, Apple can easily negotiate the prices at which it wants to acquire these chips, and both Qualcomm and Intel will do their level best to provide the best possible deals to the company. In this way, Apple can guarantee itself a much higher profit margin with its iPhone 7 sales.

iPhone 7 Plus (3)

The iPhone 7 Plus is also expected to feature larger battery capacity, higher internal storage, as well as boast a new chip developing technology called FoWLP, which stands for Fan-Out Wafer Level Packaging. Using this technique, smartphone OEMs, including Apple can heavily reduce the thickness of their future mobile devices because this particular technology does not require a PCB. Additionally, FoWLP also contributes to efficiency up to 30 percent, and combining Apple’s improved CPU design, optimized design and FoWLP, we have a real winner on our hands.

iPhone 7 Plus (2)

What did you think of the latest images of iPhone 7 Plus? Tell us your thoughts and concerns right away.


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