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Intel’s X299 HEDT Platform with LGA 2066 Socket Codenamed ‘Basin Falls’ – Launch Pushed Forward to Computex 2017 in June

Apr 9, 2017
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It looks like Intel’s upcoming X299 platform will be codenamed Basin Falls and will be launching sometime in June. The leak stems from Benchlife.info, a very reliable source we have been using for almost a decade. Not only has the code-name been leaked, but in typical benchlife style, they have also given a lot of details regarding the platform as well.

Intel's upcoming X299 HEDT platform codenamed 'Basin Falls'  detailed, launching in June at Computex 2017

The previous date for the release of HEDT X299 platform was rumored to be around Gamescom sometimes in August, but Benchlife claims this is going to happen by Computex this year - and they have a very good reason for doing so as we will soon see. The event is going to be held from May 31 to June 3, and it looks like Intel is planning on launching the brand new Basin Falls X299 platform at that time.

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Production schedule of Kaby Lake X and Sky Lake X.

Skylake-X processor production is slated for the 25th week of the year, or late June (19th – 25th). Kabylake-X processor production is slated for the same time span as Skylake-X. Qualification of the samples will take place between May 29th- June 4th.  Since this is pretty much the same time frame as Computex, we can see why Benchlife is claiming an unveiling event at Computex. We should also expect to see a showcase of motherboards from various manufacturers.

The HEDT launch lineup will include at least four SKUs that will make their way to the X299 platform. All processors will utilize the 14nm process node, however, the Kaby Lake-X chips may have a slight edge due to the process optimizations. This would result in better clock speeds with reduced power consumption, adding to the efficiency.

The four SKUs will include a 10 core, 8 core, 6 core and 4 core model. The 10, 8 and 6 core models will be based on Skylake architecture. The 4 core model will be based on the Kaby Lake architecture which launched on mainstream platforms earlier this month. All Skylake-X chips will feature a rated TDP of 140W while the Kaby Lake-X chip will feature a TDP of 112W. All chips will be marketed as the Core i7-7000 series processors utilize the LGA 2066 socket.

The LGA 2066 socket of the HEDT Basin Falls platform is called Socket R4. SKL-X will have up to 44 PCIe 3.0 lanes (a total of 68 lanes) while as Kaby Lake-X will have only up to 16 PCIe 3.0 lanes (a total of 40 lanes). Skylake-X will have qud channel DDR 4 memory up to 2667 in 1DPC mode and up to 2400 in 2DPC mode. Kabylake-X on the other hand will only have dual channel DDR4. The Kaby Lake PCH will have 24 PCIe 3.0 lanes, 8 Sata Gen3, 10 USB 3.0 pots and connected via 4 DMI 3.0 lanes to the processor. Intel LAN (Jacksonville PHY) will also be present on the chipset.

Intel HEDT Processor Families:

Intel HEDT FamilyGulftownSandy Bridge-EIvy Bridge-EHaswell-EBroadwell-ESkylake-XSkylake-XSkylake-XCascade Lake-X
Process Node32nm32nm22nm22nm14nm14nm+14nm+14nm+14nm++
Flagship SKUCore i7-980XCore i7-3960XCore i7-4960XCore i7-5960XCore i7-6950XCore i9-7980XECore i9-9980XEXeon W-3175XCore i9-10980XE
Max Cores/Threads6/126/126/128/1610/2018/3618/3628/5618/36
Clock Speeds3.33/3,60 GHz3.30/3.90 GHz3.60/4.00 GHz3.00/3.50 GHz3.00/3.50 GHz2.60/4.20 GHz3.00/4.50 GHz3.10/4.30 GHz3.00 / 4.80 GHz
Max Cache12 MB L315 MB L315 MB L320 MB L325 MB L324.75 MB L324.75 MB L338.5 MB L324.75 MB L3
Max PCI-Express Lanes (CPU)32 Gen240 Gen240 Gen340 Gen340 Gen344 Gen344 Gen344 Gen344 Gen3
Chipset CompatiblityX58 ChipsetX79 ChipsetX79 ChipsetX99 ChipsetX99 ChipsetX299X299C612EX299
Socket CompatiblityLGA 1366LGA 2011LGA 2011LGA 2011-3LGA 2011-3LGA 2066LGA 2066LGA 3647LGA 2066
Memory CompatiblityDDR3-1066DDR3-1600DDR3-1866DDR4-2133DDR4-2400DDR4-2666DDR4-2800DDR4-2666DDR4-2933
Max TDP130W130W130W140W140W165W165W255W165W
LaunchQ1 2010Q4 2011Q3 2013Q3 2014Q2 2016Q3 2017Q4 2018Q4 2018Q4 2019
Launch Price$999 US$999 US$999 US$1059 US$1700 US$1999 US$1979 US~$4000 US$979 US
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