AMD has announced that it would be jointly working with memory manufacturer SK Hynix in the development of next generation High-bandwdith 3D Stacked memory products and solutions. Currently, there seems to be a huge need of bandwidth in processors (accelerated processing units) and graphic cards which require huge bandwidth output from the memory to sustain the graphical workload, this issues won’t be fixed until higher bandwidth and stacked memory kicks off to full commercialization.
AMD And Hynix Developing High-Bandwidth Stacked Memory
AMD is the first to announce this joint development with Hynix since they noted that 2.5/3D stacked memory has already started shipping in FPGAs and Image sensor devices yet nothing is available on the mainstream and high-performance side which includes graphic processing units, accelerated processing units and several processors. Bryan Black, 3D program manager at AMD had the following to say:
“..there is nothing yet in mainstream computing CPUs, GPUs or APUs” but that “HBM (high bandwidth memory) will change this.”
“Getting 3D going will take a BOLD move and AMD is ready to make that move.” Black announced that AMD is co-developing HBM with SK Hynix which is currently sampling the HBM memory stacks and that AMD “…is ready to work with customers.” via Electroiq
So what is 3D Memory and how will it help solve the bandwidth crisis faced by APUs and GPUs? Die stacking mainly involves several memory chips stacked ontop of each other in a single die through 3D layering. This helps save both power consumption and space as you may have noted that current GPUs have memory arranged on the back when using excess of 4 GB VRAM such as the GeForce GTX Titan. This produces heat on both end so the less scattering of the chips on a board surface would result in lower temperatures for the PCB. The 3D Stacked memory would be used for both graphics, network memory as HBM and 3D Stacked design for Main memory.