Industry Page 7 of 56

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NVIDIA CEO Isn’t Worried About Big Tech ‘Splurging’ $660 Billion on the AI Infrastructure Buildout, Saying It Will Ultimately Pay Off

Increased DRAM costs to increase smartphone BoM (Bill of Materials) by up to 25 percent, resulting in lowered shipments

Memory Suppliers Are Reportedly Taking “Zero” Chances on Being at the Losing End of DRAM Contracts, Hardwiring Higher Prices Into Every New Agreement

TSMC could surpass Apple in market value by 2030, predicts analyst

TSMC’s Japan Plans Are Now Looking Much More Aggressive, as the Chip Giant Will Produce 3nm Chips in the Region to Support Gigantic AI Demand

Intel CEO Lip-Bu Tan Threatens to Fire Anyone Whose Chip Exceeds B0 Stepping, as 14A's 'Holy Grail' PDK 0.9 Lands October 2026

Intel Shows No Signs of Leaving the GPU Business, as CEO Lip-Bu Tan Reiterates Commitment, Saying Future Lineups Will Be Built Internally

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The NVIDIA-OpenAI Fiasco Isn’t About Compute, It’s About Control; Here’s How One of the World’s Biggest AI Partnerships Is Playing Out

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Intel Plans to Re-Enter the Memory Business as the Firm Pairs With SoftBank to Introduce a New Solution, Capitalizing on Ongoing Shortages

SMIC made more revenue in Q4 2023 compared to the same period in 2021

China’s SMIC Is Expanding Advanced Packaging Efforts by Establishing a Research Center to Explore New Ways to Scale Performance Beyond Moore’s Law

SK Hynix Buried Under Customer Cash Offers to Expand Memory Output, but Insider Warns Available Capacity Is ‘Essentially Zero’

Memory Prices Reach “Shocking” Levels as Manufacturers Are Now Quoting a Whopping 125% Premium, Turning DRAM Into a Full-Blown Seller’s Market

TSMC reportedly introducing price hike for 2nm wafers for four consecutive years

TSMC’s 2nm Chip to See the Fiercest Competition Yet Among AI Customers as Next-Gen AI Chips Are Expected to Heavily Rely on the Process

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TSMC Needs to Double Production Over the Next Decade Just to Meet NVIDIA’s Demand, Says Jensen Huang, Highlighting the Future Scale of the AI Boom

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NVIDIA’s ‘Trillion-Dollar’ Dinner With Taiwanese Partners Shows Us Why Jensen Will Always Remain One Step Ahead in the AI Supply Chain

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NVIDIA’s $100 Billion Mega-Deal With OpenAI Is in Danger as Jensen Believes the Company Has Grown ‘Sloppy’ While Rivals Surge Ahead

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TSMC Founder Morris Chang Makes a Rare Public Appearance as the 94-Year-Old ‘Semiconductor Titan’ Meets NVIDIA CEO at a Local Taiwanese Restaurant

YMTC 128L QLC 3D NAND chip resting on an orange circuit pattern background.

China’s YMTC Plans to Fast-Track NAND Production at Wuhan Fab, as the Manufacturer Looks to Capitalize on the Gigantic “Gold Rush” in AI Storage

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Chinese AI Giants Are Now Getting the “Green Light” to Buy NVIDIA’s H200 AI Chips, as Jensen’s Diplomatic Gamble Begins to Bear Fruit

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NVIDIA CEO Pushes Back on “Shift” Narrative, Saying the U.S. Chip Production Target Requires TSMC to Add More Capacity, Rather Than Abandoning Taiwan

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Elon Musk’s Mega “TeraFab” Project Will Combine Memory, Chips, and Packaging in One Facility, Claiming It’s the Only Way to Reach the Needed Scale

SK Hynix Plans to Establish a Dedicated US-Focused Wing, Ironically Called the “AI Company,” to Capitalize on Memory Demand

NVIDIA Looks to Intel’s 18A/14A Process and EMIB Packaging for Next-Gen Feynman AI Chips, Signaling a Major Foundry Shift Beyond TSMC

A person wearing a shiny, black jacket is in front of an NVIDIA chip and a grayscale image of the same person wearing an

NVIDIA Has a Single Point of Failure, and That Is Jensen Himself; as Questions Mount Over Team Green’s Missing Successor

A large silicon wafer with multiple microchips is resting on a perforated metal surface.

“TSMC Is the De Facto Brake on the AI Buildout”, as Analyst Claims the Foundry’s Delay in CapEx Increase Could Cost Hyperscalers Billions in Revenue

LPDDR Memory Demand For NVIDIA Rubin In AI To Exceed The Combined Demand of Samsung & Apple In 2027

A Chinese AI Chip Startup Unveils a Roadmap That Suprisingly Pledges to Be On-Par with NVIDIA’s Cutting-Edge Vera Rubin By 2027

A person holding two NVIDIA Blackwell chips, with text on the left chip reading 'NVIDIA H100 T1' and on the right chip reading 'NVIDIA B100 2025 0242A2M00.'

NVIDIA’s “Dearest” Neocloud, CoreWeave, to Get Early Access to Next-Gen Vera CPUs in a New Deal as Jensen Hints at a Push to Dominate the CPU Market

HBM3E and HBM4 chips on display in a lighted frame.

Samsung Set to Be Among the First to Feature HBM4 in NVIDIA’s Vera Rubin AI Lineup, Having Reportedly Passed All Verification Stages

NVIDIA and AMD Choosing TSMC as Their Primary Foundry Partner Became One of the Biggest Bets They Ever Made, and It Redefined Dominance

Man speaking on stage with Siemens and foundry visible in the background.

Intel Gives Rundown on 14A/18A Chips & Advanced Packaging Opportunities, Revealing Customer Commitments Expected to Flow In by H2 2026

Intel CEO Lip-Bu Tan Threatens to Fire Anyone Whose Chip Exceeds B0 Stepping, as 14A's 'Holy Grail' PDK 0.9 Lands October 2026

Intel CEO Blames Pivot Toward Consumer Opportunities as the Main Reason for Missing AI Customers, Says Client Growth Will Be Limited This Year

Intel Showcases Industry’s First “Glass Core” Substrates With EMIB Advanced Packaging, Acting as a Key Enabler For Next-Generation AI Chips

NVIDIA's CEO Jensen Huang

NVIDIA CEO Jensen Huang Reflects on Selling Shares at $300M to Buy Parents a Mercedes S-Class After the IPO, Saying He Now Regrets the Timing

MLPerf v5.1 AI Inference Benchmark Showdown: NVIDIA Blackwell Ultra GB300 & AMD Instinct MI355X In The Spotlight 1

NVIDIA Is Feeling the Heat From AMD’s Instinct MI455X AI Chips, Triggering Unusual Vera Rubin Upgrades to Hold Its Competitive Edge

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“Like Selling Nuclear Weapons to North Korea”: Anthropic CEO Dario Amodei Blasts U.S. Decision to Approve NVIDIA’s H200 AI Chip Exports to China

A person standing in front of an Intel sign, holding a semiconductor wafer, wearing an 'intel foundry' vest.

Intel Wins U.S. SHIELD Contract to Supply Chips & Advanced Packaging Under $151 Billion Defense Program, Leveraging Its Domestic Fab Capabilities

3nm wafer

Samsung’s U.S. Taylor Facility Reportedly Becomes Top Choice for Customers Looking Beyond TSMC, as Intel Struggles with “Execution Challenges”

Tesla Goes “All In” on Chipmaking as Elon Musk Confirms Dojo3 Is Back on Track; AI5 Chip to Rival NVIDIA’s Blackwell with Much Better Perf/$