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Intel Core i7-5930K
Hardware

Today, Intel finally launches their HEDT (High-End Desktop) platform codenamed Haswell-E for PC enthusiasts. The Haswell-E platform marks the start of a new generation of the PC platform loaded with the latest X99 chip set based motherboards and the new DDR4 memory which will be the future standard for the upcoming CPU platforms. Included in the Haswell-E CPU family is the Core i7-5960X Extreme Edition processor which is Intel’s first 8 Core processor built for the consumer market.Intel Haswell-E Core i7

Intel Haswell-E Including Flagship Core i7-5960X Extreme Edition Processor Officially Launches

The Haswell-E platform is going to be the great platform for users who are gearing up for the next generation graphics cards and performance upgrades such as the NVIDIA Maxwell “GeForce 900 Series” and AMD’s GCN based Volcanic Islands family. The Haswell-E family includes three processors; the Core i7-5960X EE, Core i7-5930K and the Core i7-5820K. Before we get into the specifications regarding the X99 chipset and new DDR4 memory, let’s take a quick look at the specifications of Intel’s Haswell-E processors.

Intel Core i7-5960X Extreme Edition Processor

The Intel Core i7-5960X Extreme Edition processor is without a doubt the most impressive consumer CPU that Intel has released yet. This is also the first native 8-Core processor from Intel which features a total of 8 Cores and 16 threads. The processor is clocked at 3.0 GHz stock and 3.5 GHz boost. The Core i7-5960X features a total of 20 MB L3 cache, 40 PCI-Express lanes, Quad Channel DDR4-2133 MHz memory support, a 140W TDP, LGA 2011-v3 socket compatibility and a price of $999 US.

Intel_xeon_e7
Hardware

if you thought that Intel’s Haswell-E was a beast, wait till you see the Haswell-EP and Haswell-EN lineup of processors. The Haswell-EP Xeon E5-2699 V3 is the flagship processor in the Xeon E5 V3 family which will launch in the next few months. The Xeon E5-2699 V3 processor was also listed on retail for 3,960.26 EUR and benched few months ago.Intel X99 Xeon Processors

Intel Haswell-EP Xeon E5-2699 V3 Processors Benchmarked On 2-Way Server Board

Haswell-EP will be Intel’s first native server platform to feature DDR4 memory support with speeds of 2133 MHz which will provide significant boost in bandwidth when compared to conventional DDR3-1866 MHz memory. Intel will also topple these chips with 40 PCI-Express Gen 3 lanes and we are looking at TDPs ranging between 70W to 145 Watts. Intel is planning to introduce their third LGA2011 socket type known as the LGA2011-3 which will debut along with the Haswell-E and Haswell-EP generation of microprocessor families. This has been known since a while and the socket change was expected considering the new features such as DDR4 memory supported by the platform.

For their next Xeon E5 platform, Intel is going to release the Haswell-EP generation of Xeon processors branded as the Xeon E5-2600 V3 which from an architecture perspective are a TOCK featuring the latest 4th generation Haswell microarchitecture. Based on a 22nm 3D Transistors process, the Xeon E5-2600 V3 family would support upto 18 cores per socket and 36 threads coupled with fast 45 MB LLC (Last Level Cache) and featuring both the Intel Hyper Threading and Turbo Boost technologies.

Intel Logo
Hardware

The first benchmarks of Intel’s next generation Core i7-5960X “Haswell-E” processor have been unveiled by Coolaler forums. While several tech sites including us have the X99 and Haswell-E review planned for 29th August, Coolaler went ahead to showcase a performance preview of the upcoming Core i7-5960X processor which is the flagship SKU of the Haswell-E lineup.Intel Haswell-E Core i7-5960X

Intel Core i7-5960X “Haswell-E” HEDT Flagship Processor Benchmarked

We have most of the details regarding the Haswell-E processors thanks to the leak from Videocardz earlier this week. The Intel Haswell-E processor lineup would include three SKUs, the Core i7-5960X, Core i7-5930K and Core i7-5820K. All processors are built on the 22nm Haswell architecture which means that they will improve the IPC performance while keeping the same power limits as previous generation processors due to enhanced power efficiency of the Haswell microarchitecture. Before moving into the feature set of the platform itself, we will detail the SKUs that will be launching in 29th August 2014:

Intel Core i7-5960X Processor

The Intel Core i7-5960X Extreme Edition would be the flagship processor of the lineup boasting 8 Cores and 16 threads. The Haswell-E Core i7-5960X will house 2.6 Billion transistors inside its 22nm die and measures at 335.2 mm which is considered a huge die. The die block diagram also shows that the Core i7-5960X is not a 12 core die as previously expected which turns out to be a Xeon core. We can see 8 Cores with a large amount of shared L3 cache in the middle with a DDR4 memory controller at the bottom and Queue, Uncore and I/O at the top side. This would be Intel’s first 8 Core consumer processor and would be clocked at 3.0 GHz base and 3.5 GHz boost frequency. The processor would feature 20 MB of L3 cache, 140W TDP and support for DDR4-2133 MHz memory. Being the flagship processor of the Haswell-E lineup, the Core i7-5960X would end up with a price of $999 US.

Intel Logo
Hardware

We have received an update on the Skylake-S iGPU front from Fudzilla.com. Fudzilla has been rock solid about Intel leaks in the past, so I won’t be tagging this as a rumor. It looks like the Skylake-S CPUs will have DirectX12 compatibility and 4K resolution support. iGPUs have really come around in the past few years (we can thank AMD for the competition) and this is great news for OEMs and users who rely only on the iGPU.Intel Broadwell and Skylake Platform

DirectX 12 and 4K Resolution Support to be Featured in Intel Skylake-S

We have already released quite a lot of Info on Skylake-S including the fact that it will be launching alongside Broadwell-K and will consist entirely of locked multiplier CPUs on release. Skylake-S is ofcourse based on 14nm and will feature optimized architecture with the downside of no unlocked multiplier. As before we have already covered details regarding Skylake-S’s iGPU before but we have a few things to add to that. For e.g the fact that Skylake-S integrated graphics will be fully compatible with DX12. Whether or not it will support all the hardware based functions of DirectX 12 is unknown. But looking at the time frame of the launch, I think this is a real possibility.

The latest version of Open GL (5.x) will also be supported alongside the latest version of Open CL (2.x). HEVC codecs VP8 and VP9 will be supported. Resolution up to 4096×2304 (4K) which is a 16:10 aspect ratio. Ofcourse there is no way on this earth that you will be able to play any modern game at that resolution, but the iGPU should suffice for 4k video playback and general screen management. This will be coupled with Intel’s 100 Series chipset, this will be led by the Intel Z170 Chipset. It will support DMI and PCIe 3.0 up to 8GT/s. The source also mentions that this is all in time for 20nm GPUs that are coming in mid-2015.

Intel Logo
Hardware

The official specifications and prices of Intel’s upcoming HEDT Haswell-E platform which includes the flagship Core i7-5960X Extreme Edition processors have been unveiled by Videocardz. The source has leaked the press deck for the Haswell-E platform which shows several new details along with a preview of the upcoming X99 motherboards which include the ASUS X99 Deluxe.Intel Haswell-E 5960X Processor

Intel Haswell-E Core i7-5960X, Core i7-5930K, Core i7-5820K Specifications Unveiled

The Intel Haswell-E processor lineup would include three SKUs, the Core i7-5960X, Core i7-5930K and Core i7-5820K. All processors are built on the 22nm Haswell architecture which means that they will improve the IPC performance while keeping the same power limits as previous generation processors due to enhanced power efficiency of the Haswell microarchitecture. Before moving into the feature set of the platform itself, we will detail the SKUs that will be launching in 29th August 2014:

Intel Core i7-5960X Processor

The Intel Core i7-5960X Extreme Edition would be the flagship processor of the lineup boasting 8 Cores and 16 threads. The Haswell-E Core i7-5960X will house 2.6 Billion transistors inside its 22nm die and measures at 335.2 mm which is considered a huge die. The die block diagram also shows that the Core i7-5960X is not a 12 core die as previously expected which turns out to be a Xeon core. We can see 8 Cores with a large amount of shared L3 cache in the middle with a DDR4 memory controller at the bottom and Queue, Uncore and I/O at the top side. This would be Intel’s first 8 Core consumer processor and would be clocked at 3.0 GHz base and 3.5 GHz boost frequency. The processor would feature 20 MB of L3 cache, 140W TDP and support for DDR4-2133 MHz memory. Being the flagship processor of the Haswell-E lineup, the Core i7-5960X would end up with a price of $999 US.

Thumbnail
Hardware

[Editorial] Today we’re going to bring you on a journey that will get you one step closer to seeing the world in the eyes of AMD and Intel and reflect on how different yet quite similar those images truly are. To understand the philosophies of both companies we have to also understand the architectures inside the products they make and get to know the reasons behind the decisions made in designing those architectures intimately.

Intel and AMD Microarchitectures – Exploring the Past, Present and the Future (Part I)

Lets start from the beginning, in 2006 AMD made the decision to buy ATi with the vision to fuse GPU cores and CPU cores into a single piece of silicone called the Accelerated Processing Unit or APU for short. AMD called this effort “Fusion” and it was the company’s main advent from buying ATi. In 2010 Intel released the first processor to feature integrated graphics but just like the company’s first effort to make a dual or a quad core processor the resulting product was a multi-chip module or an MCM for short. Intel called this design Clarkdale & it was not a fully integrated monolithic solution. The graphics portion had its own separate die and it was connected to the main CPU die using an interposer.

Intel-Logo
Hardware

[Editorial] I read a very interesting report by Daniel Nenni over at SemiWiki.com and thought I would share it and add upon it. The report concludes that Intel’s 14nm node has still not entered volume production. Now this report is not a leak, and is rather an exercise in deductive reasoning by the author. Therefore, take the authenticity of this report as you will; I for one, completely agree with the arguments given.

Intel Broadwell Delay Analysis

Intel Broadwell 14nm Has Not Entered Volume Production Yet – Why Though?

Lets begin with a brief overview of Intel’s process nomenclature. Intel’s modern process names starts with P12 as a suffix in a 5 digit nomenclature. The P12 is followed by 2 numeric digits that depict the process advancement in an increasing order. Each successive die shrink is exactly 2 numbers apart. For eg Intel’s 45nm Process was called P1266 and was produced in 2007. The 32nm Process was called P1268 and was produced in 2009. Similarly the P1270 Process is the current 22nm implementation being used (produced in 2011). The 14nm Process, as you may have guessed by now is called P1272. And this is the process that has been giving Intel so much trouble. See, Intel has been following Moore’s Law to the letter and introducing a die shrink every two years, that is, uptill P1272. P1272 also known as 14nm 2nd Generation FinFET (Tri Gate) technology was supposed to start volume production by the end of 2013. Provided you don’t live under a rock, you would have noticed that 2014 is approaching its end and there is still no sign of the 14nm products. In fact, we are slated for Broadwell-K arrival in Q2 2015 by last reports. So just what went so wrong?

Gigabyte Logo
Hardware

Press Release - GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced its latest overclocking contest hosted on HWBOT.org, the GIGABYTE Z97-Pentium AE Beat the Heat Challenge. The main focus will be centered on the latest GIGABYTE 9 series motherboards and the G3258 Intel® Pentium® Anniversary Edition CPU.

GIGABYTE-Z97-Pentium-AE

GIGABYTE Z97-Pentium AE beat the heat challenge to be hosted on HWBOT.ORG

The challenge is open to all HWBOT.org overclockers and will be separated in 5 stages running various benchmarks on air/water cooling and LN2 cooling. A total of USD $2,000 in cash prizes and two GIGABYTE Z97X-SOC LN2 will be offered to the winners, as well as a lucky draw with 5 participants winning a GIGABYTE G-Powerboard kit.

To celebrate the 20th anniversary of the Pentium® brand, Intel delivered to the overclocking community an unlocked processor with great potential at a very fair price. To put this bad boy to the test, GIGABYTE is giving HWBOT’s community the opportunity to see if they can keep their cool under pressure and win big from August 24th until September 28th, 2014.

Intel Logo
Hardware

Intell Haswell-E, the latest iteration of the HEDT Platform, has a launch date of 29 August (originally mid September) and now it seems that a few days before release we are are getting some confirmation on the PCIE lanes. It turns out that the information leaked by Coolaler was correct and the i7-5820 will only have 28 lanes of PCIE 3.0 while the 5930 and the 5960X will have 40 lanes of PCIE 3.0 each. Intel Broadwell and Haswell Refresh Platform

Intel Core i7 5820K Haswell-E HEDT Processor to Feature Only 28 PCIE 3.0 Lanes

The leaked image (courtesy of EXPReview.com) shows some very interesting wording, stating that when the  i7-5820K is used, the number of PCI-E lanes will decrease. This will ofcourse result in the hexacore processor becoming unattractive to Multi GPU users although they should still have some playing room. With 28 lanes you are looking at 16x, 16x/8x, x8/x8/x8/x4 maximum GPU configuration while a normal 40 lane configuration would be 16x, 16x/16x, 16x/16x/8x or 8x/8x/8x/8x depending on the amount of GPUs you have. Considering the fact that this is PCI-E 3.0 we are talking about there is enough bandwidth for a 3-Way SLI or 4 Way Crossfire. However, if you really want that extra edge then you will have to upgrade to the i7-5930k.

DX12 logo
Hardware

We haven’t head much on the DirectX 12 front, or the API front in general, for a while now. At this year’s SIGGRAPH however, Intel demoed DX 12 and showed impressive results. TDP Constraints are one of the biggest problems in Mobile Gaming, but with DirectX 12 the TDP of the device in question can actually drop by as much as 50% or you can opt for a performance increase of ~60%.

DX11 19FPS SIGGRAPH INTEL DEMOIntel Demo DX 11 TDP and FPS Baseline.

Intel DX 12 demo at SIGGRAPH shows a 60% boost in Performance Per Watt for Mobile Gaming Devices

DirectX 12 is, as I am sure you all know, a low level API. It works by reducing the CPU Overhead or the CPU Bottleneck effect by allowing the CPU to issue more drawcalls among other things. However, while this result is mostly performance increase in the Desktop sector, in the mobile side of things this is actually very useful. Since a Mobile Platform is always working with power and thermal constraints, both the CPU and GPU share a TDP Budget if you may, so any lack of power consumption by one can either be utilized in a zero sum or result in a decreased TDP rate. This is exactly how Intel has manged to show a 60% performance per watt boost in the mobile platform. This is pretty amazing news considering this is not a new architecture or a hardware change we are talking about but a new soft update.  Observe the two pictures below while keeping the baseline above in mind:

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Intel’s Broadwell CPU microarchitecture has been detailed and previewed showcasing the several core features of Intel’s next generation micro processors. Anandtech has received several press slides from Intel detailing the new features of Intel’s upcoming Core M processors which will be the first processor family to feature Broadwell core architecture giving us a glimpse at what to expect from the new core.Intel Broadwell CPU Performance IPC

Intel Broadwell CPU Architecture Analyzed – 5% IPC Increase Over Haswell

Intel’s Core M is basically the Broadwell-Y SKU which we have had details regarding since a while but the core architecture details have been a secret until now. This is just a preview of what to expect from the Broadwell CPU architecture but there’s some juicy information regarding Broadwell in these slide so let’s get on with it. Intel has recently released their Haswell Refresh lineup and we know the reason behind this launch is due to the fact that Intel had nothing else in their pockets to launch this quarter. Intel’s 14nm is hit by production issues and they are getting desperate to get new products out as soon as possible which is the sole reason why Brian Krzanich vowed to have Broadwell chips ready by Holiday 2014. Hence, this quarter we saw a refreshed line of Haswell chips, a family of new K-Series Haswell processors codenamed Devil’s Canyon, a new chipset platform for Haswell and beyond (Z97 / H97) and the upcoming Haswell-E HEDT platform which arrives on 29th August 2014. So far, this year has been Haswell this and Haswell that but Intel’s Haswell-E platform will be the last of the Haswell micro architecture we will get to see as Intel is planning for Broadwell by Q4 2014 (atleast for the mobility market).

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Introduction

Back in June 2013, Intel launched their Haswell generation of processors (4th Generation Intel Core) which was an architecture scaling from 95W desktop parts to 4.5W Mobility parts. The Haswell architecture was decent in terms of power efficiency and was the first to bring 22nm to the consumer market but over at the desktop side, things weren’t all that great. The Core i7-4770K processor, the flagship of the desktop lineup had enhanced just about everything over the 3770K, it featured a faster graphics chip, better overclocking support and was priced similar to its predecessor however the core performance of the Haswell chips wasn’t a dramatic improvement over Ivy Bridge and to make things more bitter, the processor was unable to reach high overclocks due to the low quality TIM (Thermal Interface Material) used for packaging the processor.

The Core i7-4770K remained Intel’s flagship processor till Q1 2014 and we were all hoping that Intel would sooner or later launch their 5th Generation Broadwell processors based on the updated 14nm microarchitecture but during late late 2013, Intel reported that they will be delaying Broadwell due to 14nm node production vows and this resulted in the time-frame shift from mid-2014 to early 2015. Broadwell does comes out during the Holiday season this year but the upcoming SKU is aimed for mobility market rather the destkop one which launches in Q2 2015.

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Braswell is probably one of the lesser known 14nm Platforms by Intel out there, and for good reason too, seeing its brand new. Basically the Pentium and Celeron branded SKUs that were usually based on the now aged Bay Trail design are now getting their own entry level platform called Braswell. We have covered Braswell news in the past but it feels like every time I do a write up on this, a new introduction is in order.intel-braswell-tablet-mobile-cpu-processor-chip-620x354

14nm Braswell Graphics will have 16 EUs and DX 11 – Intel HD 8th Gen iGPU

These entry level processors are of course aimed at getting a share of the market that AMD’s APUs dominate, specifically, the HTPC market. This market is used mostly for high quality playback and maybe even some casual gaming so a bad iGPU or the lack thereof can be a deal breaker. Blue’s answer to this is ofcourse introducing entry level Braswell Processors that will have their own spectrum of notebook, tablet and desktop SKUs. Now Braswell will be one performance tier above the Bay Trail processors while still retaining the same power efficiency. Needless to say the GPU itself must be atleast passable. The GPU, we now know consists of 16 EUs and supports DirectX11; all thanks to Intel HD 8th Generation Graphics.

Now this information comes from Fudzilla.com and they correctly note that this is the same amount of execution units that were present in Ivy Bridge two years ago. Simply put this GPU should smoke the counterpart present in Bay Trail M and D variants. Other specs include a 4 Lane PCI Express 2.0 rated at 5GT/s, which should allow decent dGPU support. The Braswell iGPU will support three 2560×1600 displays and is capable of running highly modern codecs such as VP9 and H.265 (this includes 4k support). Now the Braswell SKUs are either going to be Dual Core or Quad Core versions. The maximum TDP is 10W and the chipset will support DDR3L1600Mhz Memory and SATA III. It also houses integrated 10/100 and 1000 Mbit LAN card as well as integrated audio SMI, LPC and SM Bus support. Braswell SOC will ship in BGA packaging while the desktop parts should come in LGA as well.

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An important update on the 14nm Broadwell Processors has appeared. The source is the very reliable fudzilla.com. Apparently these 14nm processors are going to have a TDP of just 65W and will also have Iris Pro Graphics along with eDRAM . This, along with the unlocked multiplier should prove to be a lethal combination for enthusiasts who will sadly not get an unlocked Skylake at launch.Intel Broadwell and Haswell Refresh Platform

Intel 14nm Desktop LGA ‘Broadwell’ Unlocked Processors Details Confirmed – Iris Pro, eDRAM and 65W TDP

Now interestingly, the source also confirms that the Broadwell processors will be landing on the LGA 1150 Socket and will therefore be compatible with most Intel 9 Series Chipset motherboards. This is of course something we have known for a very long time (and pointed out in our Z97 reviews too!). As you may recall we received a leak which more or less confirmed that these SKUs will only be arriving in the ‘K’ variant (for now), meaning unlocked Broadwell processors at launch. Now as of yet we only have knowledge of the one Quad Core variant, but the source points out that there might be a crippled dual core version at a later date. At this point however, I differ a little. Whether we see a crippled dual core variant is very dependent on how the sister platform fares.

I am talking of course, about Skylake-S, which is supposed to land around the same time. It will be this trigger (whether or not Skylake-S Launch is going as planned or not) that will bring about a Dual Core Variant, if at all. Finally Broadwell-K will support PCIE-3.0, DDR3/DDR3L 1.5V and will come in i5 and i7 variants with 4 threads and 8 threads respectively. I suspect we should see some decent IPC gains on this one when it comes in June 2015. It will also be very interesting to see how Skylake-S fits into the grand scheme of things since the afore-mentioned platform will only contain locked processors with no unlocked ones coming anytime soon. Summarizing everything we get:

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A server grade Intel LGA 2011-3 socketed motherboard along with the Haswell-EP Xeon E5 V3 processor have been spotted on sale over at EBay (via Overclock.net). Part of Intel’s upcoming Haswell-EP processor line, the new Xeon E5 V3 chips will feature improved IPC performance to meet demands of high-performance computing.Intel Haswell-EP Xeon E5 V3

Intel LGA 2011-3 Motherboard and Haswell-EP Xeon E5 V3 Processor On Sale At EBay

The server grade motherboard we are looking at is designed for 2S operations so it makes use of dual LGA 2011-3 sockets which are fully compatible with the upcoming Haswell-EP processors. The sockets resemble the LGA 2011 socket since the design for both is kept the same if you have noticed the earlier X99 motherboard leaks. The LGA 2011-3 server motherboard is large and built for workstations and server environment hence the odd design and form factor. It features a total of 24 DDR4 DIMM slots and a total of 384 GB DDR4 memory using 16 GB memory sticks and more if using denser memory sticks or if the motherboard can actually support them but it possibly will given its workstation nature. The motherboard comes with several connectors and ports while the C610 chipset is hidden beneath the silver colored aluminum heatsink.

The motherboard is damaged from several areas as mentioned by the seller on EBay but it is in working condition so you can try your luck to get this working perfectly if you buy one but there’s no guarantee. Aside from the LGA 2011-3 motherboard, there’s also a Haswell-EP Xeon E5 V3 processor on sale which is in engineering state. The specific processor known as QFGH ES 2.10 GHz is clocked at 2.10 GHz and was manufactured in USA but aside from that, there are no details given. 2.10 GHz is a low clock so this chip could boast a higher core count but that is just speculation from my end. A few of you may ask, how do I even know this ES processor is an Haswell-EP CPU?



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