AMD APU
Hardware

AMD announced in late august that it would introduce a new type of bundle specifically targeted towards system builders. These bundles are officially called “Power Packs” and they include six processors in one box. The media jokingly referred to it as a six pack. Anandtech has published an excellent interview with AMD’s Adam Kozak who’s a Product Marketing Manager for the company. The interview sheds some light on previously unmentioned details of the new bundle.

photo 5

AMD Processors at a Discount for System Builders

The first batch would feature the Richland based Athlon 760K quad core CPU and the Richland based 6600K A8 class APU. This new bundle is focused on relatively smaller system builders that would usually buy boxed CPUs to build systems with. Larger builders would usually resort to buying trey processors without the standard heatsink that comes in the box but would instead add their own cooling solutions. This bundle doesn’t necessarily target those types of system builders according to AMD.

What is the expected discount to be over buying them separately?
Currently the difference between PIB and Tray is 5-10% depending on the APU, so the Power Packs will be somewhere in the middle of that, to both offset the semi-bulk purchasing with coolers and without a large chunk of the packaging that might come with a PIB version. Exact discounts will vary between regions.

Intel Logo
Hardware

[Not Confirmed] An interesting point raised by the Italian publication Bitsandchips.it, stated that Intel has tucked away a very big hint pertaining to memory support in its IDF14 slide deck. Upon closer inspection the hint is about DDR3 and DDR4 support at the same time probably utilizing a Dual-IMC design . The market is now moving toward DDR4 but its prices remain quite high, so it might be possible that Intel will introduce the above-mentioned tech to hasten the transition. Intel Broadwell and Skylake Platform

Dual-IMC with DDR3 and DDR4 Support Could Grace Skylake Processors – Hints IDF14 Slides

As we told you a long time ago and as Intel later confirmed in IDF14, Skylake-S is coming in 2H 2015, most probably July. These will be quad cores and will come in i5 and i7 variants with 4 and 8 threads respectively. Skylake will of course also arrive on mobile platforms and 2-in 1 devices before the desktop release. If you notice the slide deck below, specifically the one on the right, you will notice that Intel mentions “DDR3 and DDR4″ in the “future” section of the Mainstream segment. Now Intel has noted down Haswell Micro-architecture, so its near future is Broadwell and Skylake-S.

a8 iphone 6 processor
Gadgets Hardware

Apple’s latest iPhone 6 variants – both the iPhone 6 and the iPhone 6 Plus – feature a second generation 64-bit A8 processing chipset. Cupertino tech leader claims that the new A8 processor will give up to a whopping 84x faster performance. The A8 chip uses a 20-nanometer manufacturing process which makes the chip 17% smaller than the first-gen A7.

However, smaller the size may be, the processor has double the number of transistors with A8 featuring 2 billion of them instead of 1 billion of A7. Apple further says that iPhone 6 A8 has a 25% faster CPU and a 50% faster GPU - that, we suppose will end in some crazy graphics.

iPhone 6 and iPhone 6 Plus: Complete Specifications and Battery Stats

iPhone 6 A8 processor

iPhone 6 A8 chip’s “sustained performance”:

What is attractive out of the entire speech on the processing chip, however, is the frequent use of “sustained performance”. Apple said that typical processors lose performance over time. However, with sustained performance, the A8 chip will keep the iPhone 6 and iPhone 6 Plus at their best. 

AMD FX Logo
Hardware

News just broke during the Deutsche Bank 2014 Technology Conference of AMD’s new x86 CPU core.  The CEO of the company Rory Read has just revealed the next generation high performance x86 core that has been referred to as the sister core of K12. The new core is called “Zen” internally by AMD & will debut alongside K12 in early 2016 as we’ve reported earlier.

AMD Core is Back

AMD’s Next Gen x86 High Performance Core is Code Named “Zen”

Rumors of “Zen” have been floating around for quite sometime now but we did not wish to report on it without confirmation. So it’s quite the relief that we got to confirm this for you our readers straight from the mouth of AMD’s top executive.

Rory Read at the Deustche Bank 2014 Technology Conference :

Everyone knows that Bulldozer was not the game changing part when it was introduced three years ago. We have to live with that for four years but Zen, K12 we went out and got Jim Keller we went out and got Raja Koduri from Apple, Mark Papermaster, Lisa sue. We are building now our next generation graphics and compute technology that customers are very interested in and they’ll ( referring to the next generation graphics and compute architecture) move to the next generation node and they’ll be ready to go.

Rory mentions Zen once again near the end of the interview

There’s very few people who know how to create server chips, you know Jim Keller has a lot of experience in that space.
You get Zen and K12. Capture ARM before it happens. I can swim backwards on mobility and try and go into cell phones, when the margins are going down and the competition is tough or we can try and look out and say where are the opportunities ? and Lisa and her team are identifying. That’s how we’ve transformed AMD. Better efficiency, better model, look to the future.

ARM architecture leadership, x86 architecture big leap forward and we do it in a package where we’ve had very good conversations with the OEMs in the server space and with the customers. And we tested it because if we didn’t see that acceptance we would’ve ended the business a year ago. But we saw that opportunity and we saw the opportunity to rebuild that and to do it in a more consistent way and I think the next generation technology will position us. Now we have to execute and deliver.

Intel-Logo
Hardware

Intel announced their next generation 14nm Skylake microarchitecture at the IDF14 conference being held in San Francisco. The Skylake microarchitecture will be a Tock in Intel’s Tick-Tock roadmap since its a totally new core architecture which will be based on the 14nm process that is going to be integrated on upcoming chips including desktop and mobility parts.Intel Skylake Processors

Intel Announces 14nm Skylake Microarchitecture at IDF14

Replacing Broadwell, the Skylake processors would be available in 2H 2015 which is just a few months away from the time Broadwell would actually be available on the high-end mobility side and desktop market. The first iteration of Skylake processors won’t replace the K-Series SKUs that Broadwell will introduce in Q2 2015 but based on a new architecture, Skylake would definitely bring further core performance improvements and enhanced power efficiency. The most notable thing about Skylake was that Intel actually had actual desktop chips at IDF14 which were demoed using 3DMark Icestorm on a desktop PC and laptop too. We are over at IDF covering the event and you can check out the videos at the end of this article.

Coming back to Skylake details, this isn’t the first time we have been told that Skylake is launching in 2H 2015. We have details from a few months ago which already confirmed this and now Intel just made it official with their own announcement.

Intel Xeon E5-2600 V3 Processor  Front
Hardware

As suspected, Intel has finally unleashed their next generation Xeon E5-2600 V3 processors codenamed Haswell-EP at the IDF 2014 event being held in San Francisco. The Xeon E5-2600 V3 lineup is going to be aimed at the HPC server and workstation market featuring 23 E5-2600 V3 SKUs including the flagship Xeon E5-2699 V3 which boasts 18 Cores, 36 threads, 45 MB of L3 cache and a high price of $4115 US.Xeon E5-2600 V3 die close

Intel Xeon E5-2600 V3 “Haswell-EP” Workstation and Server Processors Unleashed

Today, Intel finally takes the lid off of their Haswell-EP lineup (Xeon E5-2600 V3) which replaces Ivy Bridge-EP (Xeon E5-2600 V2) from last year. Built on the latest Haswell microarchitecture, the Haswell-EP lineup ushers into a new era of high-performance computing on the server and workstation side with specifications and core performance improvements which are just amazing.

Starting off with the architectural details, the Intel Haswell-EP Xeon E5-2600 V3 is configured into several die variants which include HCC (High Core Count), MCC (Medium Core Count) and LCC (Low Core Count models). The LCC variants range from 4-8 cores, configured on a 354mm2 die consisting of 2.6 Billion transistors. The MCC die has 10-12 cores, configured on a 492mm2 die consisting of 3.84 Billion transistors while the HCC die which is reserved for the flagship parts including the Xeon E5-2699 V3 ranges from 14-18 core variants and configured on a 662mm2 consisting of a mind boggling 5.69 Billion transistors. The previous Ivy Bridge-EX flagship had 4.31 Billion transistors configured on a 541mm2 so its easy to tell that the Haswell-EP takes die size and transistor count to a new level. The Xeon E7-2600 V3 “Haswell-EN” processors which are reserved for launch later might have even higher core configurations but their arrival is scheduled around Q4 2014 or Q1 2015.

Intel-Logo
Hardware

A few days back Intel confirmed that they will not be using Extreme Ultra Violet Scanners to produce 10nm dies, something that though expected, still managed to raise a few eyebrows. Most of Silicon Valley agreed that Intel does not need EUV to pass 10nm, but it had also agreed that Intel would have absolutely no trouble with 14nm and that doesn’t appear to be the case.

Original Forecast

Extreme Ultra Violet Scanners Will Not Be Needed for P1274 (10nm) – Intel

Intel has been acting very weird as of late, it has delayed its road map of 14nm processors and has been following Moore’s Law on a sheer technicality. Intel is now stating that the 10nm Processors that are queued for 2016 will not require EUV Scanners. “We know we can get through 10nm without EUV,” said Brian Krzanich, CEO of Intel at the Citi Global Technology Conference. Once again, the statement is not really surprising, its only when you put it in context with the Broadwell delay that eyebrow raise I mentioned earlier happens.

See, Intel really should not have had problems with 14nm, there just isn’t any conceivable reason for it. The delay could have been artificial in nature but we wont recognize that facet in this post because that isn’t an official stance. So the question is, how can Intel confidently predict 10nm in 2016 without EUV after the unforeseen hurdles they faced with Process 1272 (broadwell)? P1272 is arriving in 2015 by the skin of its teeth so how can P1274 a die shrink, arrive in 2016? With EUV it would have been child’s play to push 10nm out the door after the initial prototyping. Ofcourse, adapting EUV is no easy task and by Intel’s comments we will not be seeing it for 2 – 3 years at least, so theres that.

AMD logo
Industry

Rory Read AMD’s Chief Executive Officer revealed in an interview with Bloomberg that AMD is targeting the first quarter of 2016 for product launches based on AMD’s latest technologies. Stating that AMD will have to endure some rough patches in the next 18 months before the new designs begin to bolster sales.

AMD is currently working on multiple product designs that will utilize new technologies. Those include two custom high performance CPU cores both ARM & X86 based, 3D stacked High-Bandwidth Memory or HBM for short, Processor-in-Memory or PIM for short and advanced 14nm FinFET manufacturing process.

AMD K12 Roadmap

 

K12 & Sister X86 Core Confirmed to be Coming in Early 2016

Rory reaffirmed that the product roadmap & launch schedule is much more reliable than ever before. With AMD engineers proving they can deliver new designs on time.
AMD still has several upcoming products before we see K12 in the first quarter of 2016. Carrizo APUs are coming next year along with new 20nm pin compatible x86 & ARM SOCs. However we won’t see next generation high performance FX CPU products until 2016. This was previously confirmed by AMD’s CVP & GM of the client division Bernd Lienhard during a Q&A session in APU14.

AMD’s FX series of processors has been relatively less active, what’s the plan for the future?

Lienhard: Last year we introduced the Piledriver architecture and achieved good market performance,we see about 30% growth. Kaveri also used the updated Steamroller architecture.

Within two years you will definitely see an update to the FX series in the high-performance market segment.

Broadwell_Die_Center_Persp_On_White_HR
Hardware

Intel has dedicated the last few months to the desktop market by launching two new platforms for the PC desktop community. In April, we saw the Haswell Refresh platform which was launched along side a flood of 9-Series chipset based motherboards. In July, Intel introduced their latest Devil’s Canyon processors and just last month, we saw the daddy Haswell platform codenamed Haswell-E which ushered a new era of enthusiasts level PCs with the latest Haswell-E processors, X99 motherboards and the first platform to support DDR4 memory on the consumer front.
Broadwell_Die_Diagonal_BW

Intel’s 14nm Core M Series “Broadwell-Y” Processors With 4.5W TDP Detailed

With the majority of Q2 and Q3 targeted towards the desktop market, Intel is now making a return on the ever growing mobility front. Intel is not going to release a new Haswell processor since they are done with that CPU architecture and Haswell-E is the last major platform release on the 22nm Haswell micro-architecture. Intel is now expanding to the mobility front with their latest 14nm process based Broadwell architecture with the first cores configured specifically for the mobility market which include 2 in 1s, notebooks and fanless devices. Meet the Intel Core M processor.

The Intel Core M name isn’t new and we got a glimpse of the processor a few weeks back when Intel gave the green light to publish some of the key architectural details regarding their new 14nm processor node. It’s very essential that we take a look at the architecture first before we get to talk about the Core M processor in detail. Intel’s focus with Haswell was to produce a highly scalable architecture which spans from tablets to desktops and even the HPC workstation market. They are keeping the same focus with Broadwell which will power a lot of devices and form factors. While PC is an established market, Intel will puts its core focus towards the growth markets which include notebooks, tablets and mobile smartphones. Intel has already a variety of Ultrabooks in the market and they recently entered the 2 in 1 form factor design which has got some attention but there are some specific rules and regulations which need to be followed. As a part of the standards which define an Ultra book, Intel wants to keep these devices power efficient, performance capable and feature days of battery life without getting hot.

Atom2
Hardware

Google owns one of the two alleged Quantum ‘Super’computers in the world, and now it wants to take that dream one step further by partnering with University of California Santa Barbara and building Quantum Information Processors. Google is already working with D-Wave Two Systems and is working hard to figure out the Quantum Annealer. Quantum processors could have many interesting applications, some of them positive, others horrific so you can safely say that the first company to mass produce these would take over the world industry.Quantum Chipset

The ‘Super Conducting’ Quantum Information Processors from Google Inc could change the World forever

Quantum processing lies primarily on the qubit, which unlike our good friend the bit, has the usual 1 and 0 states and can also exit in a superimposed state. Another major difference between normal processors and quantum processors is the quantum tunneling effect, which basically means that they can intuitively sense the answer (a very very crude estimation). Needless to say, armed with features like these, the perfected quantum processor will have drastic consequences. An example being that all current encryption techniques, which rely on prime numbers, will become obsolete over night.Information is currently scarce on the project and we only have what Google stated in their post.

AMD FX Logo
Hardware

The last AMD announcement for today is the new x86 Piledriver CPU refresh which includes the FX-8370, FX-8370E and FX-8320E processors. The new FX CPU refresh comes four months after Intel launched their very own Haswell Refresh lineup which includes the Devil’s Canyon processor. Rather than focusing on performance, AMD targets Intel with their brute pricing model which offers users a 4.4 GHz clock chip with 8 Cores at a low price of $199.99 US.AMD FX-8370 FX Piledriver Price

AMD Launches x86 Piledriver Based 125W FX-8370 and 95W FX-8370E, FX-8320E

Back at the Radeon event held last week, AMD demonstrated a live overclocking preview of the FX-8370 processor where renowned overclocker “Chew” from Xtremesystems overclocked the chip past 8 GHz and even got to see a overclock world record of the FX-8370 a few days from overclocker “The Stilt” who had the chip clocked at an impressive 8.7 GHz on liquid nitrogen cooling. The show detailed nothing else regarding the FX processors but we already had received information on the new refresh chips prior to event so let’s do a quick run through of what we are looking at today.

Let’s get started with the FX-8370 now which will become the flagship x86 Piledriver processor of the original FX-8000 lineup until AMD plans to launch a new processor line (hopefully no refresh). AMD does have steamroller but they aren’t focusing it towards the high-end desktop market instead focusing it towards the APU market with their Kaveri APUs and Athlon processors. The FX-8370 is clocked at 4.30 GHz base and 4.40 GHz boost clock and ships with a 8 MB L3 cache, 8 cores. 125W TDP and a price of $189 US. The FX-8370E on the other hand has the same specifications aside from the 3.3 GHz core and 4.3 GHz clock speeds maintaining a TDP of 95W. Both the FX-8370 and FX-8370E are priced at $199.99 US.

AMD FX Logo
Hardware

During AMD’s 30 years of graphics innovation event AMD’s Finnish overclocking team was able to achieve a new CPU frequency world record. Hitting an exceptionally impressive 8.722Ghz with all 8 cores enabled on the upcoming FX 8370 CPU.

FX 8370

 

FX 8370 Hits Highest Eight Core CPU Frequency Ever Recorded

Liquid Nitrogen cooling was used to achieve this frequency at a staggeringly high voltage of 2.004 V. The motherboard used was the Crosshair Formula-Z from Asus with 8GB of memory operating in dual channel mode at 2218Mhz in addition to an Asus DCUII R9 290X graphics card. This is the highest overclock ever recorded on an eight core CPU with all of its cores enabled. Which is quite an achievement besting the previous world record of 8.41Ghz on an eight core CPU with all cores enabled held by Smoke by over 300mhz.

Andre Yang, a famous overclocker, managed to push an FX 8350 to 8794Mhz. Which is still the highest frequency ever achieved but it was only on two cores out of the eight. At this rate I wouldn’t be surprised to see the overclocking community break the 9Ghz barrier shortly after they get their hands on the upcoming FX 8370.

AMD FX Logo
Hardware

Last Thursday Roy Taylor AMD’s VP of Global Channel Sales made an appearance in MaximumPC’s no BS podcast primarily to sit down with Origin PC’s CEO Kevin Wasielewski & discuss the situation that had occurred back in October of last year which revolved around Origin PC ceasing to offer AMD GPUs to customers.

Both parties cleared the air and made amends. But a LOT of very exciting information was revealed in the process. So without any further delay lets get into the juicy bits !

AMD Dragon

Next Gen HEDT FX CPUs & 20nm GPUs in the Works

So lets get the relatively less exciting stuff out of the way first. Roy Taylor AMD’s VP of Global Channel sales discussed AMD’s R9 285 graphics card coming in September 2nd powered by the all new Tonga GPU which promises incredible performance at significantly higher power efficiency compared to AMD’s current R9 280 graphics card. We covered this already in great detail here.

Intel Core i7-5930K
Hardware

Today, Intel finally launches their HEDT (High-End Desktop) platform codenamed Haswell-E for PC enthusiasts. The Haswell-E platform marks the start of a new generation of the PC platform loaded with the latest X99 chip set based motherboards and the new DDR4 memory which will be the future standard for the upcoming CPU platforms. Included in the Haswell-E CPU family is the Core i7-5960X Extreme Edition processor which is Intel’s first 8 Core processor built for the consumer market.Intel Haswell-E Core i7

Intel Haswell-E Including Flagship Core i7-5960X Extreme Edition Processor Officially Launches

The Haswell-E platform is going to be the great platform for users who are gearing up for the next generation graphics cards and performance upgrades such as the NVIDIA Maxwell “GeForce 900 Series” and AMD’s GCN based Volcanic Islands family. The Haswell-E family includes three processors; the Core i7-5960X EE, Core i7-5930K and the Core i7-5820K. Before we get into the specifications regarding the X99 chipset and new DDR4 memory, let’s take a quick look at the specifications of Intel’s Haswell-E processors.

Intel Core i7-5960X Extreme Edition Processor

The Intel Core i7-5960X Extreme Edition processor is without a doubt the most impressive consumer CPU that Intel has released yet. This is also the first native 8-Core processor from Intel which features a total of 8 Cores and 16 threads. The processor is clocked at 3.0 GHz stock and 3.5 GHz boost. The Core i7-5960X features a total of 20 MB L3 cache, 40 PCI-Express lanes, Quad Channel DDR4-2133 MHz memory support, a 140W TDP, LGA 2011-v3 socket compatibility and a price of $999 US.

Logo Apple iPhone
Gadgets

This just in. With almost every detail about the iPhone 6 launch confirmed, there are yet more leaks to follow about Apple’s flagship device. We’ve been hearing more and more rumors and reports about the mobile wallet platform and NFC for the iPhone 6. These are said to be ‘hallmark’ features of the smartphone. The timing might be just right for such a move as well, with the vast troves of data already with Apple due to iTunes.

Well, the french site nowhereelse.fr has just posted pictures of what appear to be the processor destined for the iPhone 6. There has been relative silence in the Apple rumor mill about the A8 so far. The only things that we expect based on a single report is that the SoC for the iPhone 6 will be able to hit frequencies of up to 2 GHz.



Creative Commons License This work by WCCF (Pvt) Ltd. is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 3.0 Unported License.
Permissions beyond the scope of this license may be available on the Terms and Conditions page. WCCF 2011 is designed by UzEE, Inc.
Ran 18 queries in 1.015  seconds.