AMD Elite Hexa Core Logo
Hardware

[Rumor][Debunked: Fake] [See comment below for more information] The first CPUZ shot of the much awaited next generation APU has finally leaked out. The source is someone I have never used before but the site in question is of very high ranking. However, I am still going to tag this as rumor because of a single inconsistency mentioned below. The website is Guru3D .

AMD A-Series Old RobotAMD A-Series Mascot Robots

AMD’s Flagship 20nm Carrizo APU A10-8890K – 95W TDP, Hexa Core and 4.4 Ghz Clock

Now a CPUZ from a reliable source is pretty much what any news house worth their salt hopes for. And this appears to be just that. The first thing I noticed is that AMD is continuing the standard APU nomenclature and the new Carrizo APU will be called the A10-8890K. The A10 prefix indicates its part in the A-10 Elite series and K suffix indicates that this particular APU will have an unlocked multiplier. Now if you take a look at the logo you will notice that it says “Elite Hexa Core”, which means that Carrizo APU has 6 cores and considering the TDP (95W) and core clock of 4.4 Ghz thats pretty damn impressive. Take a look at the CPUZ yourself:

Intel Logo
Hardware

Intel is releasing their HEDT Haswell-E processors in the coming months which includes the flagship Core i7-5960X CPU. Since the processors are built for the high-end desktop market, their target audience would be overclocking fanatics and enthusiasts. My friend, Kevin Owi at OCDrift has revealed an interesting feature regarding the new processors which will help overclockers in setting the fastest frequency records.Intel Haswell-E Core i7-5960X De-lid

Intel’s Flagship Haswell-E Core i7-5960X Processor De-Lidded – Uses Soldered TIM

Kevin was able to get hold of an Intel Core i7-5960X processor which will be the flagship part of the Haswell-E lineup and de-lidded it to reveal that it makes use of soldered thermal interface material instead of inferior thermal paste material which was featured on Ivy Bridge and Haswell processors which is blamed as one of the reasons for the high temperatures we got to see on those processors aside from the fully integrated voltage regulator (FVIR) which is being phased out after Broadwell generation of processors.

The Core 4000 series processors based on the Haswell microarchitecture were launched a year ago at Computex 2013. The processors featured the latest 22nm core 3D Tri-gate transistors technology which improved the IPC and efficiency by a decent amount of Ivy Bridge. While the Haswell processors were met with a great response and backed by a variety of overclocking features, the processors didn’t happen to be great at overclocking due to the cheaper application of TIM between the IHS (Internal HeatSpreader) and the Haswell silicon itself which resulted in the heat to remain trapped between the chip due to poor contact.

AMD_Trinity_Preview_Logo
Hardware

[Rumor] The Italian site bitsandchips.it has posted something quite radical today. Citing inside sources, the website claims that the FM2+ socket is sticking around till 2016,and we won’t be seeing DDR4 Support on desktop till the same time. It also claimed that we will not be getting a post Bulldozer architecture till 2016. Needless to say a pinch of salt is a must here.AMD Excavator Performance

AMD FM3+ Socket, DDR4 Support and Post-Bulldozer Architecture in 2016, Carrizo Notebook Only till then – Alleges Italian Report

Ironically, I posted my speculation on AMD’s 12 Core truckload teaser a few hours ago and discussed multiple possibilities. While these ranged from 12 Compute Cores, to 12 Steamroller Cores to a New Architecture, if this report is correct then that pretty much throws all of that out the window (excluding HSA). The report claims that AMD’s FM2+ socket is going to stick around till 2016. Since DDR4 is going to come with the FM3+ socket, the Italian site says that we will not be seeing DDR4 on any desktop products till 2016. The report seems pretty confident about these facts and cites them as such. Summarizing:

  • AMD’s FM3+ Socket in 2016.
  • New Post Bulldozer/SMT Architecture in 2016.
  • No DDR4 Support in Desktop Processors till 2016.
AMD Core Logo
Hardware

Update: The teaser is actually done on an easy to spot ”cool truck” template found on the web (thanks to _John_ for that) but the image itself was posted by AMD PR. See my comment below for more information.

[Caution: Not Confirmed] I noticed something pretty interesting posted over at Planet3DNow. Basically the guys over there have managed to find an AMD PR image that was posted under the #AMDEvolved twitter handle (I couldn’t find the picture myself, but I probably didn’t look hard enough). The picture depicts 12 AMD Robots. Since the robots are an analogy for cores, it doesn’t take a genius to figure out that AMD is planning something with 12 Cores.

AMD 12 Core ProcessorA truck carrying 12 AMD ‘Cores’. The A Series Logo depicting APUs is also visible.

PR Material Hints at an A Series APU with 12 CPU Cores – Probably Steamroller

Before I let the wrong idea through let me explain why I have tagged it as ‘Not Confirmed’. See, AMD has a very funny way of naming cores. Kaveri has, according to AMD, 12 compute cores. 4 of these cores are CPU and 8 of these are CUs. Ofcourse this is pretty misleading since CPU and GPU cores are nothing alike, but the fact remains. It is possible that these 12 Robots depict 12 Compute Cores as opposed to just 12 Steamroller Cores and I wanted to make that clear. This is also the reason I have tagged the post as not confirmed. An interesting thing to note is that AMD introduced a new ‘robot’ in their “Core is Back” teaser video, which has a red color scheme. However these are the old robots with the standard white color scheme. This seems to suggest that all these robots are on the old steamroller architecture and not a new one. And since Kaveri already exists, boasting a 12 Compute Core A Series APU doesn’t make any sense and therein lies the logical conclusion: the truck must be boasting 12 Steamroller Cores.

Intel-Logo
Hardware

The Russian site overclockers.ru has released some pretty interesting information about Intel’s Atom Processors specifically the Moorefield platform.  This platform is specifically targeted to the mobile sector, namely the tablet and android segments. The Moorefield platform boasts 4 cores (which is 2 more than Merrifield) and 64bit support all on 22nm.Intel Atom Merrifield and Moorefield

Intel Atom Moorefield Processors Begin Shipping – Quad Cores on the 22nm Node

Now Merrifield is a completely new platform that Intel introduced specifically for the smart phone sector. Even though it is currently bleeding money out of Intel Corporation, the fact of the matter is that they need to keep moving forward to breach the barrier to entry. Before the actual leak, I think a brief intro is in order. The Moorefield platform, which is somewhat of a successor to Merrifield has SoCs that are 64 Bit Quad Cores. Its previous codename was Anniedale and is based on the Silvermont micro architecture. It does not support hyper threading and will have exactly 4 threads. Now information after this is somewhat hazy but Morganfield is supposed to succeed Moorefield on the 14nm node. Morganfield will make the shift to Goldmont micro architecture and was previously codenamed Broxton.

AMD Core Logo
Hardware

AMD has just posted their “Core is Back” teaser over at their Facebook page which hints at an imminent CPU announcement. Now this may sound crazy but this actually coming from AMD’s official Facebook and Youtube pages makes this so much more interesting that we couldn’t wait to find out what this announcement is about actually.AMD Core is Back

AMD CORE IS BACK Teaser Video

AMD Teases “Core Is Back” Teaser and Core Evolution Video

AMD is teasing their upcoming CPU announcement with a picture on their Facebook page and a CGI Video on their YouTube channel. The Facebook page and Youtube Video lists down the following statements:

The war continues to rage and battles may be lost but heroes will evolve.#AMDEvolved via AMD Facebook

“In your PC, applications battle for resources. While powerful CORE hardware fights to maintain the balance. But the war never ends. And the applications only get stronger. Battles may be lost. But heroes will EVOLVE. CORE IS BACK!” via AMD YouTube

When I first saw this picture, I thought it was some fan prompting AMD to release a new CPU but after looking at the teaser video, I become quite excited myself. As you can note, the “Core is Back” title is a conformation that a new CPU announcement is coming and some might even say that core can also be used for GPU but if you take a look at the video, you will notice that applications and CPU have a mutual relationship and makes it the only device to do such a teaser announcement for. The video itself is called “Core Evolution” which hints that the new core technology is an evolution of an existing architecture. So this could be a new FX launch, an updated Kaveri APU or a FX APU based on Steamroller architecture with the iGPU disabled for faster core clock speeds.

AMD Kaveri APU
Hardware

Evidence regarding stacked DRAM on next generation AMD APUs has surfaced once again which gives hints that the upcoming Carrizo APU or its successor will be the first APUs to enable high-bandwidth stacked DRAM design on-chip.AMD APUs Carrizo APU Stacked Memory

Evidence Regarding AMD APUs Featuring High-Bandwidth Stacked Memory Surfaces

It has been known for a while that AMD is sampling their first generation HBM (High Bandwidth Memory) and we can find official specifications in slides dating back to December 2013. While there was no mention of what product or application may make use of HBM back then, the latest slides from AMD’s official Fast Forward presentation talks regarding stacked DRAM specifically on APUs. The Fast Forward project’s objectives are to enhance the high volume APU architecture and investigate in next generation processor and memory tech for exascale and consume scale systems.

Within the presentation, you can find several references of stacked memory and new APU technologies such as HSA+, PIM (Processing In Memory) and Two Level memory. Some of these are already part of the current AMD APU family such as Kaveri which introduced several new features such as HSA on software and steamroller, gcn or hardware side.

Intel-Logo
Hardware

Intel’s upcoming Braswell Processors are quite something. They are basically very power efficient SoCs for the entry level segment of Desktop Computing. Basically Intel did not have any real offerings in the “HTPC (Home Theater PC) Segment” and is ready to get a piece of the pie. Intel has started taking mobile computing seriously only in these past few years and the consequences of the same are already becoming apparent ( in a good way).intel-braswell-tablet-mobile-cpu-processor-chip-620x354

Intel Braswell SoCs (14nm) Have Possibly Been Delayed to Second Quarter of 2015

Currently the only core that comes near the archetype of Braswell is the Bay Trail Core however the Braswell will be one performance tier above the Bay Trail processors while still retaining the same power efficiency (which is quite a feat). Now here is the thing, our source CPU-World.com tell us that even though the 14nm Braswell SoCs were coming in Q1 2015, the “ready to ship” timeframe for the same might have moved to Q2 of 2015. The reason for this being that Intel is working in mysterious ways this year. This also means that we would be catching the first glimpse of these processors in mid march or mid may of next year.

Intel has already released two refreshes of the Bay Trail platform, each iteration more powerful than the previous. There is another refresh coming in Q4 2014 to top it all of.  However, a power vacuum remains between the mainstream Desktop Processors (currently Haswell Refresh) and the atom processors. It is this vacuum that Braswell will fill. We also have the Core M processors coming soon along with Cherry Trail so it looks like Intel is going all out on the mobility spectrum of computing which is about damn time. Currently this particular segment is dominated by AMD’s APUs and it is clear that Intel wants in on the action. These processors are an ideal choice for people who want a “streaming box (Steam’s inHouse Streaming) ” in their lounge in an ultra small form factor. With your real rig somewhere else in the house, an HTPC serves as the ideal “front end”.

Intel Logo
Hardware

Intel’s HEDT (High End Desktop) has always been somewhat of a roller coaster ride with its loyal consumers one or two architectural generations behind the mainstream consumer processors. Intel offsets this lag in the process by giving a higher core count which translates to 4 threads on the high end model. However this does not come cheap because even though we had authentic reports that most of the Haswell-E pricing wouldn’t change, an online retailer Shopblt.com has listed them far more expensive than Ivy Bridge-E.Intel Broadwell and Haswell Refresh Platform

Haswell-E Intel HEDT Processors Price List Spotted at Online Retailed

Now here’s the thing. Intel has adopted a two year architectural life span for HEDT instead of the mainstream yearly strategy. So that means Intel either has to skip generations for its HEDT spectrum or let it fall behind the mainstream spectrum. Ofcourse the profit motive dictates that Blue follows the latter. However with Haswell-E, modest IPC gains will get blown away by not 2 but 4 more cores than consumers. That is twice the cores that mainstream offers and that’s 8 more threads for an absolutely stunning total of 16 threads. This is how Intel compromised and tried to get into the good graces of the hardcore enthusiasts. It all seemed to make sense when we heard that pricing wont change except for the i7-5820K and that was only because it was getting two more cores (i7-4820K was a Quad Core). However, if this online retailer Shopblt.com is correct than it would appear that Intel is getting ready to squeeze some extra cash again.

AMD APU
Hardware

AMD’s Carrizo APU “Mobile” platform specifications and details have been unveiled in a slide posted by VR-Zone. The slide confirms pretty much everything we have known about Carrizo and will end much of the confusion that has been build around the information regarding AMD’s 5th generation of accelerated processing units for their mobile platforms.AMD Carrizo APU Platform Details

AMD Carrizo APU “Mobile” Platform Details Unveiled

The platform details regarding AMD Carrizo APU have been unveiled for the Mobile platform rather the desktop platform but we will believe that the desktop platform will be similar in terms of architecture and design as was with Kaveri generation of processors, earlier this year. If you look at the picture of the slide posted by VR-Zone, you will note that it is very similar to the SteamrollerB powered Kaveri 2.0 platform slide which was leaked almost 8 months ago and turned out to be true at the time of Kaveri’s launch since most of the details reported were accurate.

AMD’s Carrizo APU would become the fifth installment in the Accelerated Processing Units family which will feature the latest Excavator core architecture. From previous leaks, we have come to know that Excavator is based on a 28nm process probably based on GlobalFoundaries since AMD chose it the node for Kaveri too. Powering the CPU side, these new x86 Excavator modular cores will leverage the IPC for greater performance compared to Steamroller. The mobile platform will feature both Quad Core and Dual Core variants but right now, we are looking at a glimpse of the top-end variant which shares 2 MB L2 cache.

weekly shorts logo
Hardware

We are back with the second installment of WCCF’s Weekly Shorts. The rules are simple, of the many articles we post, we shortlist not more than 7 entries and summarize them in not more than 5 lines. The previous episode of the WCCF’s Weekly Shorts can be found here.weekly shorts main image

Weekly Shorts – Peeping EA, AMD Carrizo, PS4′s 60FPS Optimization, Benefits of Sand, Anti-Theft Protection Debunked and the GM200 Core

1. EA is Spying on You by File Snooping with the Origin Client – Official Investigation Begins

Origin is one of the biggest gaming clients out there and it turns out that it does more than just let you play EA Games. In this report we take a look at what some dedicated gamers have uncovered. Basically the Origin Client is also an accomplished file snooper and is actively spying o your usage habits. Origin Reps have stated that they have begun an official investigation. Read More about Origin’s File Snooping.

Intel-Logo
Hardware

Details of Intel’s next generation Skylake-S platform have been revealed by VR-Zone, unveiling that the new processors will be available in 2H of 2015 and a new motherboard series featuring the latest 100-Series chip. Configurations of various Skylake series processors were unveiled not long ago which mentioned that the time span between the launch of Broadwell and Skylake generation would be small and both platforms would be available to consumers by 2015.Intel Skylake-S Desktop Z170 Chipset

Image Courtesy of VR-Zone!

Intel Skylake-S Desktop Platform Detailed – Z170 Chipset Replaces Z97 in 2H 2015

While the current Z97 series motherboards do add support for Broadwell processors, Intel won’t have the chips ready for consumers till at least Q2 of 2015. The first iteration of Broadwell processors which will launch for PCs will be in the form of Intel Core-M and Broadwell Y-Series which will arrive in holiday 2014 and are aimed toward the tablet and laptop market. The actual desktop processors won’t be available till 2015 which is a bit surprising since at the time Intel launches Broadwell-K series, they will be shipping Skylake-S to consumers in the exact same quarter or a bit late (moving in early 2H 2015). This was showcased in the latest Intel Desktop roadmap leak for consumers.

The transition to Z170 chipset will not be a massive upgrade and would be similar to what the Z97 was to Z87 with a little added features such as more PCI-e lanes, Super Speed USB and up to 10 USB ports compared to 6 standard ones found on the current iteration of motherboards. There will be a total of six 100-series chipset SKUs which will include the Z170 (Performance) replacing the Z97, H170 (Mainstream) replacing the H97, H110 (Value) replacing the H81, B150 (Small and medium Business) replacing the B85 and the Q170 plus Q150 chips with Intel vPro / SIPP which will replace the Q87 and Q85. So as you can note, Intel has the entire replacement plan ready which will update the current desktop chipset stack in 2015. Intel is already phasing out their Ivy Bridge-E and Z77/H77/H75/Q75 chipsets in early 2015. This transition won’t eliminate support for Z97 or Z87 in 2015 since there would be a majority of consumers who will still be running Broadwell and Haswell processors since these platforms have spanned a longer shelve-time in the market and will cease to exist along side each other for a couple of years.

AMD Kaveri APU
Hardware

[RUMOR] Notice the shiny tag at the start. Continue. We have received some information regarding AMD’s upcoming APU Carrizo, this information is unverified so I will be treating it as a rumor. The report comes from the Italian site bitsandchips.it and states that AMD’s upcoming flagship APUs will have Stacked DRAM while maintaining the 28nm Node.

Carrizo APU RoadmapThe Quite Old ‘Leaked’ Roadmap

Carrizo APU will be based on the 28nm Node and have HBM (High Bandwidth Memory)

Now it goes without saying, that you need to keep that pinch of salt handy throughout this post. However this news, if true, is very interesting. We know for a fact that APUS benefit a lot from good memory and if these APUs will truly support HBM then we can expect to see some very substantial performance per clock gains while jumping from Kaveri to Carrizo even while staying on the same node. Another important point to note is that with the Carrizo APU the implementation of HSA will be perfected resulting in probably significant in compute as well as gaming.

Now we already know that AMD is working with Hynix to create Stacked DRAM.  We also know that this memory will come in two types, namely 3DS and HBM (Don’t be fooled by the lack of 3D in this name, both are stacked). The memory that is in question here is the HBM variant type which will feature the highest bandwidth and I know for a fact that there are two types already in production. Namely the 2-Hi and 4-Hi variants. You can find the detailed analysis of the same in my Pascal Architecture Analysis. Now the max bandwidth of a single HBM is 128-256 GBps (compare this to the 28GBps of GDDR5), so we are looking at an insane growth in bandwidth, albeit at reduced clocks (most probably around 1000Mhz).

Intel Quark Logo
Hardware

Intel’s Quark and Edison Projects marked the beginning of Intel’s next step in the miniaturization of the smart PC. However much like the early days of Atom, its not being taken very seriously at the moment with progress slow and lathargic. However, we just received an update from CPU-World.com that the Quark will be replaced by Dublin Bay sometime in 2015.intel galileo with quark soc x1000

 

Intel Quark X1000 SoC to be replaced by Dublin Bay Platform in Mid 2015 – 1-2W TDP

Now the quark is all about tiny devices. Where Quark covers both embedded and wearable applications, its smaller sibling, the Edison, covers mostly wearable. It was near the end of 2013 that the first Quark SoC (the X1000) was launched although it wasn’t until February 2014 that developers actually received the Galileo board (Intel’s Raspberry Pie rival) which sadly however could not make a significant dent in the market occupied by its competitor. The Quark chips had a very simple die layout. The specs are as follows:

  • 1 Core
  • 16KB L1 Cache
  • DDR3 Controller
  • 512KB On-die SRAM
  • PCIE 2.0 and USB 2.0 Supported
  • Price: $9-$12
VIA Logo
Hardware

The company Centaur Technology, which is a subsidiary of VIA Technology (which is not a very known incorporated, ill admit) has recently demoed (via benchmarks) the capability of its brand new upcoming x86 architecture processor to rival AMD and Intel directly.Intel Broadwell and Haswell Refresh Platform

VIA’s Isaiah II x86 Architecture Allegedly Sweeps the Floor with AMD and Intel

Now the benchmarks we received appear to get the upper hand on both Intel and AMD processors alike, but since there are some very serious points of contention,  we shall approach that in a minute. Now the x86 architecture codenamed Isaiah II is basically being developed by Centaur Technology and will be revealed in approximately two months. You can find the exact countdown over here. Now the x86 processors made from this architecture will be targetted to the same market sector that is currently housing AMD’s Kabini and Intel’s Bay Trail processors. So we are looking at a low end product primarily for embedded uses and maybe some very low-end Dekstops.



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