GTX 980 Logo

The final specifications and the architectural details regarding the GM204 GPU fused inside NVIDIA’s next generation and flagship Maxwell graphics card, the GeForce GTX 980 have been revealed by Videocardz. NVIDIA’s GeForce GTX 980 and GeForce GTX 970 launch in just three days on Friday but we have already started looking at preliminary performance results, several non-reference graphics cards from AIB vendors along with tons of new information regarding these chips.NVIDIA GeForce GTX 980

NVIDIA GeForce GTX 980 Graphics Card and GM204 GPU Detailed

Starting with the GM204 GPU which makes use of the second generation Maxwell core architecture that has faster per core performance than first generation Maxwell based chips (GM107) before it and has several new features which deliver better performance and great power efficency making GeForce GTX 980 one of the most efficient flagship offering in history. This is all achieved with the 28nm process node so one can imagine about the numbers we can expect when NVIDIA hops to an even lower process in the future. However, people are still worried about the fact that not being on a 20nm process doesn’t make the GTX 980 as a worthy contender to the Kepler architecture but that’s not true since the card has achieved some great feats and we will be able to see that in the performance reviews which arrive this weekend.

Alright, so the GM204 has two variants, the GM204-400 which is fused on the GeForce GTX 980 and the GM204-200 which is fused on the GeForce GTX 970. We know a lot about the GeForce GTX 970 since a few weeks now but the real flagship part to be discussed is the GeForce GTX 980’s GM204-400 chip. The GM204 chip features 4 GPC (Graphics Processing Clusters) which feature four SMM blocks each. These blocks include four logic units each which consist of 32 cores so in total, a single SMM unit results in 128 Cores while the 16 blocks available on the GM204-400 chip equate to 2048 CUDA Cores. The GM204-200 has three less SMM units which result in a lower core count of 1664 thus making it around as fast as the GeForce GTX 780 while the GTX 980 will tackle the GeForce GTX 980 with a good 15-20% performance lead.


Looks like Videocardz has finally spilled the beans on the specs of the Maxwell Flagship, Geforce GTX 980. And its shaping up to validate the Chiphell leak we published a week ago. We can’t release the die shot of the GPU for certain reasons this time, but if VCZ has posted this, you can be rest assured its true.Maxwell-GTX-980-

Maxwell Flagship Geforce GTX 980 Rocks 2048 CUDA Cores with 16 SMMs

As you already know both cards will be launching on the 19th of September, 12:01 AM PDT to be exact. While the GTX 970 is completely ready, Nvidia was having some trouble with custom GTX 980 cards so there is a slight possibility that Custom GTX 980s will be delayed. The Geforce GTX 980 has 16 Streaming Maxwell Multiprocessors (SMM) which in turn have 128 CUDA cores each, bringing the total to 2048.

Since the wattage of the GTX 970 is 148W, the 980 should have a maximum of 180W TDP, although the actual number should be less. With 2048 Maxwell cores we are looking at more or less GTX 780 Ti performance at decent clocks and more at high clocks. Which once again validates the Chiphell leak I mentioned above. Sadly for performance minded enthusiasts (myself included) this means that Nvidia is chasing power efficiency. This, in my personal opinion, should not factor much in a high end product. On the GTX 970 die, you can notice the nomenclature GM204-200-A1, and as VCZ reveals, the nomenclature for the GTX 980 die will be GM204-400-A1. Both the 970 and the 980 feature two 6 Pin connectors, 256Bit Bus and 224GB/s of bandwidth. The leak scene for this generation of Nvidia products appear to be drawing to a close, but there is still the big launch to look forward to. And ofcourse the curious case of the GM200 GPU.



The ASRock ‘FATAL1TY’ X99X Killer is a serial killer that you want to have on your side. Okay, okay – so it’s not really a serial killer (at least not during the daytime), but the ASRock X99X Killer completely kills the competition in terms of a budget gaming board that delivers in a lot of ways in terms of all the current ASRock X99 offerings. The MSRP of $289.99 comes with this board that is layered with a black/red design surface and adorns the X99 emblem of CPU support. The board itself features Super Alloy components, which are simply stunning, ranging from the Aluminum Alloy heatsinks, to the Power Choke 60A that provide for better current saturation across the PCB. The ASRock X99X Killer also comes with the Killer e2200 LAN which is something that we only see in higher end boards, and it’s a great thing to see this being used here for network performance being optimal per gaming packet.

Being the choice for the hardcore gamer on a budget, ASRock really delivers something for the value. The ASRock X99X Killer comes with the Realtek 1150 powered chipset that runs across the I/O with support for Purity Sound 2.0 – a real nice software multiplexer for audio that can handle 7.1 surround sound before the world starts looking to 12.1 for consumer use.

Logo Apple iPhone

With the iPhone 6 launched, and pre-orders for the device started, the question on every Apple lover’s mind is which iPhone 6 is the right one? After all, this September marks the first time in company history that Apple has released two variants of it’s flagship smartphone and finally catered towards the larger screen demands of the market.

The two iPhone 6 models this year came with a Retina HD display. Retina HD was an upgrade from the iPhone 5S’ simple Retina display. So what really separates the iPhone 6 Retina HD from the iPhone 5S Retina display? Let’s find out in terms of the way points are mapped and rasterized onto screens.


Noctua NH-D15


The Austrian based cooler manufacturing company, Noctua, is a name renowned by several enthusiasts and overclockers in the PC industry. Emerged back in 2005, Noctua has become one of the most respected cooling product manufacturer in the industry with their legacy products such as the highly acclaimed Noctua NH-D14. Released back in 2009, the NH-D14 hit the market like a wild fire offering superb cooling performance on the most high-end Intel and AMD processors with its dual heatsink stack design which several cooling product makers have followed since.

Noctua, at their core are a desktop-centric manufacturer aiming to deliver specialized coolers with incredible cooling performance and low noise output that has won the hearts of many enthusiasts since 2005. Looking at the current state of the desktop PC market, the OEM shipments are constantly declining while there is still a boom in the DIY market which Noctua aims to deliver high-end products for. This decline in the PC market has been due to the emergence of compact and portable devices such as smartphones and tablets which don’t require a high-end cooling solution nor do casual users need to overclock. So one asks, why is there a need for high-end coolers when all they want to do is browse the internet and watch movies. The only thing such bulky coolers will do is output more noise which would be a let down for the product itself.

Logo Apple iPhone

As we all know, Apple launched the iPhone 6 and the iPhone 6 Plus yesterday. The iPhone 6 launch was one of the most anticipated events this year, as is generally the case with Apple events. Claiming to think different, the company has always stuck to the basics and improvement of individual aspects of the device rather than equipping it with high hardware specifications.

The iPhone 6 is in no way different from this philosophy and now we can finally compare the device to what might be said to be it’s biggest rival – the Samsung Galaxy S5. The Galaxy S5 is a beast when it comes to specifications. Packing an quad core 2.5 GHz processor with 2 GB of RAM on board, the device is fully set to charge at it’s competition.

So which device ends up being the better option? Lets find out.


Well well well, the leak we have all been waiting for has arrived. The source is the Chinese Baidu Graphics Post bar and everything from GPU shots to Specs of the Nvidia Geforce GTX 970 have leaked out. The leak confirms the specs of the GTX 970 Maxwell GPU. Galaxy GeForce GTX 970 GC 4 GB GDDR5

Nvidia Maxwell GM204 GPU – GTX 970 Rocks 1664 Cores, 4GB of GDDR5 Memory and 1Ghz+ Core Clock

As you already know, the release date for the GTX 970 is 19th of September, so we are literally a week or so away from the official unveiling. The GeForce GTX 980 and the GTX 970 are the upcoming flagship GPUs from Nvidia and will be based on the GM204 GPU. We have seen leaked performance numbers but now we finally have an authentic spec leak for the same. Two cards have merged from the Chinese forums which include the reference and non-reference GeForce GTX 970 variants from vendor Galaxy Microsystems. We will first of all detail the reference variants which features the same short PCB design featured on the GeForce GTX 670 and even adopts the same reference cooling scheme.

The GeForce GTX 970 has the Device Id “NVIDIA D17U-20″ and the GPU Id for the graphics core is 13C2. We have our own speculation regarding that but before we get into that, let’s denote the entire specifications listed on the GPU-z panel. The GM204 SKU featured on the GeForce GTx 970 fuses 1664 CUDA Cores on the die along with 32 ROPs and 138 TMUs. From the first generation Maxwell core architecture, we learned that a Maxwell SMM (Streaming Multiprocessor Maxwell) unit has 128 cores compared to 192 on the current generation Kepler SMX units. The TMU count is a bit off since the maxwell core architecture holds 8 TMUs per SMX so we were supposed to see 104 TMUs in total instead of 138 so it could be a GPU-Z fault which could mean that these specifications might not be the actual deal.


Considering a good half day has passed since Apple released its bigger and bolder iPhone 6 and iPhone 6 Plus and its first ever Apple Watch, we hope that you too know at least a little about yesterday’s saga. If you have missed on the details and highs and lows of yesterday’s event, here is an Apple Keynote roundup to help you get the gist of the event and its highlights. At the end of this post, you will see a streaming video that, if you are interested, will help you catch up with yesterday’s event live from AppleApple keynote roundup

2014 Apple Keynote roundup:

Keynote streaming yesterday was filled with lags here and there. While the live streaming was only open to the lucky many of us who owned a “Safari”, it too was filled with gaps and typical technical glitches. For the most part, live streaming kept repeating the first few minutes making it quite worthless, if we can be harshly honest. You, however, are a lucky person as we have presented to you a very concise glimpse of what Apple’s 2014 keynote was all about. So here we go with a thorough Apple Keynote roundup!unlocked iPhone 6 price Apple keynote roundup


Intel announced their next generation 14nm Skylake microarchitecture at the IDF14 conference being held in San Francisco. The Skylake microarchitecture will be a Tock in Intel’s Tick-Tock roadmap since its a totally new core architecture which will be based on the 14nm process that is going to be integrated on upcoming chips including desktop and mobility parts.Intel Skylake Processors

Intel Announces 14nm Skylake Microarchitecture at IDF14

Replacing Broadwell, the Skylake processors would be available in 2H 2015 which is just a few months away from the time Broadwell would actually be available on the high-end mobility side and desktop market. The first iteration of Skylake processors won’t replace the K-Series SKUs that Broadwell will introduce in Q2 2015 but based on a new architecture, Skylake would definitely bring further core performance improvements and enhanced power efficiency. The most notable thing about Skylake was that Intel actually had actual desktop chips at IDF14 which were demoed using 3DMark Icestorm on a desktop PC and laptop too. We are over at IDF covering the event and you can check out the videos at the end of this article.

Coming back to Skylake details, this isn’t the first time we have been told that Skylake is launching in 2H 2015. We have details from a few months ago which already confirmed this and now Intel just made it official with their own announcement.

Logo Apple iPhone

The moment is here folks. The one that a lot of us have been waiting for. Apple has just launched the iPhone 6 and the device comes packing several impressive, albeit already expected features on board. Coming in two variants the iPhone 6 comes with Apple’s latest A8

The 5.5 inch variant as expected is called the iPhone Plus. The display size was a decision made from the start according to Apple. The devices are to be 6.9 and 7.1 mm thick respectively, which is not that much of a difference keeping in mind the advanced requirements of the larger screen variants.


Apple Launches Two iPhone 6 Variants – 4.7 inch And 5.5 inch Versions Do Not See Much Difference In Thickness

Saying that the upgrade in screen size was planned from the start, the iPhone 6 has Retina HD display aimed towards giving developers more options when designing apps for the iOS 8 on board. Apple SVP of marketing Phil Schiller the two devices 1,334-by-750 at 326ppi for the 4.7-inch and 1,920-by-1080 pixels for the 5.5-inch version.

Extra keys have also been added to the soft keyboard and Apple has added new display modes on the 5.5 inch iPhone 6 variants. The Retina HD display touted for both the phones has an even higher resolution than before. The 5.5 Inch iPhone 6 Plus features a staggering 185 percent more pixels than it’s predecessors.

Logo Apple iPhone

Well folks, it looks like the iPhone 6 leaks aren’t ready to stop. Even though Apple is all set to launch the iPhone 6 in just 7 hours. All of these leaks about the device make us wonder over here at wccftech that maybe iPhone 6 related leaks will continue well after the device has been launched. Excuse the bad joke, but today’s leak is the most comprehensive one yet so far and has distorted our usually top notch sense of humor.

Coming straight out China (where else really) and spotted by CultofMac, the list fully covers almost all the technical specifications of the device. Apple has seemingly decided to respond to the Galaxy S5’s unfortunate ice bucket challenge, since the first thing that catches our eye is that the iPhone 6 will be waterproof. But that’s not the most surprising aspect of the phone’s durability.

iPhone 6 pre-order

Massive iPhone 6 Specification Outing Lists Device As Waterproof And Shatterproof – 8 MP Camera And 2 GHz A8 On Board

In addition to being waterproof, the iPhone 6 will also be shatter proof. Meaning that all the pesky trouble with breaking your device when you accidentally ‘let it go’ can now expected to be over. It also looks like sapphire glass finally made it on the device despite earlier reports that the material was facing some problems.

Intel Xeon E5-2600 V3 Processor  Front

As suspected, Intel has finally unleashed their next generation Xeon E5-2600 V3 processors codenamed Haswell-EP at the IDF 2014 event being held in San Francisco. The Xeon E5-2600 V3 lineup is going to be aimed at the HPC server and workstation market featuring 23 E5-2600 V3 SKUs including the flagship Xeon E5-2699 V3 which boasts 18 Cores, 36 threads, 45 MB of L3 cache and a high price of $4115 US.Xeon E5-2600 V3 die close

Intel Xeon E5-2600 V3 “Haswell-EP” Workstation and Server Processors Unleashed

Today, Intel finally takes the lid off of their Haswell-EP lineup (Xeon E5-2600 V3) which replaces Ivy Bridge-EP (Xeon E5-2600 V2) from last year. Built on the latest Haswell microarchitecture, the Haswell-EP lineup ushers into a new era of high-performance computing on the server and workstation side with specifications and core performance improvements which are just amazing.

Starting off with the architectural details, the Intel Haswell-EP Xeon E5-2600 V3 is configured into several die variants which include HCC (High Core Count), MCC (Medium Core Count) and LCC (Low Core Count models). The LCC variants range from 4-8 cores, configured on a 354mm2 die consisting of 2.6 Billion transistors. The MCC die has 10-12 cores, configured on a 492mm2 die consisting of 3.84 Billion transistors while the HCC die which is reserved for the flagship parts including the Xeon E5-2699 V3 ranges from 14-18 core variants and configured on a 662mm2 consisting of a mind boggling 5.69 Billion transistors. The previous Ivy Bridge-EX flagship had 4.31 Billion transistors configured on a 541mm2 so its easy to tell that the Haswell-EP takes die size and transistor count to a new level. The Xeon E7-2600 V3 “Haswell-EN” processors which are reserved for launch later might have even higher core configurations but their arrival is scheduled around Q4 2014 or Q1 2015.


[Op-Ed] The industry has evolved over the years to the point where getting reviews out the second the NDA lifts, or the product launches, is not only common place but required by publications. While this practice is all well and good for hardware, gadgets and even games with single player focus, it shouldn’t be applicable to online games. Bungie is now actively trying to discourage this norm via PR. However, even though I agree with the sentiments the developer has unwittingly created a Prisoners Dilemma of sorts.Bungie - Destiny Day One Review Featured

The Prisoners Dilemma – To Publish Destiny Review on Day One or Not

Calling this interesting development a Prisoner’s Dilemma might be an over simplification or an over complication depending on your viewpoint, but one that stands to logic. Before I delve further into this opinion editorial, let me first elaborate a little on what a Prisoner’s Dilemma is. This particular situation is a subset of the wider ‘Game Theory’ (this has very little to do with games) and one of the more rampant corporate scenarios, usually between two rival companies. It goes like this, say there are two prisoners who got caught without evidence. Prisoner 1 is offered 2 options. He can either stay quiet and go to jail for 4 or he can snitch on his partner and get only 1 year of jail time. Prisoner 2 is offered the same deal. The possible combinations of what can happen are as follows: 1) if both Prisoner’s stay quiet they will get 4 years each. 2) If one of them snitches on the other while the other remains quiet, the snitch will get 1 years while his partner 7 years. 3) If both of them snitch, both of them will get 7 years.


Intel has dedicated the last few months to the desktop market by launching two new platforms for the PC desktop community. In April, we saw the Haswell Refresh platform which was launched along side a flood of 9-Series chipset based motherboards. In July, Intel introduced their latest Devil’s Canyon processors and just last month, we saw the daddy Haswell platform codenamed Haswell-E which ushered a new era of enthusiasts level PCs with the latest Haswell-E processors, X99 motherboards and the first platform to support DDR4 memory on the consumer front.

Intel’s 14nm Core M Series “Broadwell-Y” Processors With 4.5W TDP Detailed

With the majority of Q2 and Q3 targeted towards the desktop market, Intel is now making a return on the ever growing mobility front. Intel is not going to release a new Haswell processor since they are done with that CPU architecture and Haswell-E is the last major platform release on the 22nm Haswell micro-architecture. Intel is now expanding to the mobility front with their latest 14nm process based Broadwell architecture with the first cores configured specifically for the mobility market which include 2 in 1s, notebooks and fanless devices. Meet the Intel Core M processor.

The Intel Core M name isn’t new and we got a glimpse of the processor a few weeks back when Intel gave the green light to publish some of the key architectural details regarding their new 14nm processor node. It’s very essential that we take a look at the architecture first before we get to talk about the Core M processor in detail. Intel’s focus with Haswell was to produce a highly scalable architecture which spans from tablets to desktops and even the HPC workstation market. They are keeping the same focus with Broadwell which will power a lot of devices and form factors. While PC is an established market, Intel will puts its core focus towards the growth markets which include notebooks, tablets and mobile smartphones. Intel has already a variety of Ultrabooks in the market and they recently entered the 2 in 1 form factor design which has got some attention but there are some specific rules and regulations which need to be followed. As a part of the standards which define an Ultra book, Intel wants to keep these devices power efficient, performance capable and feature days of battery life without getting hot.


The day has arrived folks. The Moto 360 is finally with is in all it’s circular glory. Being the most anticipated smartwatch of the year, the Moto 360 does not disappoint in it’s specs. In fact, it’s specs were quite similar to the ones outed by Best Buy in it’s listing of the device.

The Moto 360 comes with a 320 x 290, 1.56 inch circular display. This is powered by Texas Instruments OMAP 3 with 512 MB of RAM. Internal storage on the Moto 360 will be 4 GB. In addition to this, all the rumors about the Moto 360 featuring a heart rate sensor were correct as well. The device also comes with water resistance, courtesy of IP67.

So with the Samsung Gear S and the LG G Watch R also being launched, it’s time for a specs showdown and in-depth comparison of the three smartwatches. While the Moto 360 does have the pleasure of being the only round smartwatch currently on the market, it will change soon with the G Watch R being released.

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