AMD Allegedly Preparing an APU with 16 Zen Cores and Greenland Graphics with HBM
Greenland is a recently surfaced codename and purportedly refers to AMD’s Radeon 400 Series graphic offering coming next year (with HBM memory). Interestingly however,a report from Fudzilla states that AMD is actually working on an x86 APU that rocks sixteen CPU cores based on Zen micro-architecture coupled with Greenland graphics. Even more interestingly perhaps, the APU will allegedly feature HBM memory (2.5D interposer).
Upcoming AMD APU to feature upto 16 Zen cores and Greenland graphics with a touch of HBM
The new platform is supposedly capable of hosting upto 16 Zen cores – ofcourse that doesn’t automatically mean it will actually happen. AMD’s architectural designing is very modular in nature, almost like lego. If AMD is leaving flexibility of upto 16 cores on the die then quite probably it plans to use it in the hpc/server section. The availability of Greenland graphics with HBM memory means that this APU will truly have an integrated GPU to lookout for – a sort of dedicated-integrated hybrid. The compute performance of the APU should be pretty remarkable too, what with Zen micro-architecture and Greenland HBM graphics.
The new platform, as of yet, does not have a name. But it will purportedly succeed th Godaveri platform sometime in 2016. The die will have four channel DDR4 support and PCIe 3.0 support. The APU will most probably be divided into 4 modules since each Zen core will have to share L3 with 4 other cores (while retaining its own dedicated L2). The CPU cores will communicate with Greenland graphics over an custom interconnect called “Coherent Fabric”. The configuration is very ideal for HSA too and we could see this becoming a titan in HPC computing based on value. As far as the high bandwidth memory is concerned, the source speculates that it could be HBM2 considering the time frame of the APU.
Keep in mind however, that if AMD actually does go forward with this APU, there is no guarantee it will make it to the mainstream consumer base. This type of die is poised ideally to take advantage of the HPC sector, and while it could tickle down to the consumer base in a toned down form, that is a probability as opposed to a certainty. AMD is probably the most dynamic company when it comes to roadmaps – they usually keep a very high level of flexibility in their plans and I won’t be surprised if this new 16 core Zen APU never makes it to the mainstream market.